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© 2025 by the authors. Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (https://creativecommons.org/licenses/by/4.0/). Notwithstanding the ProQuest Terms and Conditions, you may use this content in accordance with the terms of the License.

Abstract

This research investigated the influences of some key factors in the prestressed laser peen forming (PLPF) process, namely, the plate thickness, the coverage ratio, and the prestress, on the deformation of 2024-T351 rectangular plates through experiments and numerical simulations. In the experiments, laser parameters, such as the laser energy and spot size, were kept unchanged, and prestress was applied through a piece of self-developed, four-point-bending equipment. The curvature radius of the samples was measured through a digital radius gauge. A corresponding finite element analysis (FEA) model of PLPF was also established to simulate the full procedure of the PLPF, including prebending, laser shock peening, and spring back. Based on the PLPF experimental results, an artificial neural network (ANN) was trained to help to design the process parameters, including the coverage ratio and the amount of prebending, according to the plate thickness and the target curvature radius. By adding a penalty term to the loss function, the amount of prebending (AOP) can be reduced as much as possible. The validation of the ANN was confirmed by three other PLPF experiments.

Details

Title
The Key Process Factors in Prestressed Laser Peen Forming and the Design of Parameters Through an Artificial Neural Network
Author
Lyu Jiayang; Wang, Yongjun; Wang, Zhiwei; Wang Junbiao
First page
445
Publication year
2025
Publication date
2025
Publisher
MDPI AG
e-ISSN
20754701
Source type
Scholarly Journal
Language of publication
English
ProQuest document ID
3194625853
Copyright
© 2025 by the authors. Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (https://creativecommons.org/licenses/by/4.0/). Notwithstanding the ProQuest Terms and Conditions, you may use this content in accordance with the terms of the License.