Abstract

As the field of quantum computing advances from the few-qubit stage to larger-scale processors, qubit addressability and extensibility will necessitate the use of 3D integration and packaging. While 3D integration is well-developed for commercial electronics, relatively little work has been performed to determine its compatibility with high-coherence solid-state qubits. Of particular concern, qubit coherence times can be suppressed by the requisite processing steps and close proximity of another chip. In this work, we use a flip-chip process to bond a chip with superconducting flux qubits to another chip containing structures for qubit readout and control. We demonstrate that high qubit coherence (T1, T2,echo > 20 μs) is maintained in a flip-chip geometry in the presence of galvanic, capacitive, and inductive coupling between the chips.

Details

Title
3D integrated superconducting qubits
Author
Rosenberg, D 1 ; Kim, D 1 ; Das, R 1 ; Yost, D 1 ; Gustavsson, S 2 ; Hover, D 1 ; Krantz, P 2   VIAFID ORCID Logo  ; Melville, A 1 ; Racz, L 1 ; Samach, G O 1 ; Weber, S J 1 ; Yan, F 2 ; Yoder, J L 1 ; Kerman, A J 1 ; Oliver, W D 3 

1  MIT Lincoln Laboratory, Lexington, MA, USA 
2  Research Laboratory of Electronics, Massachusetts Institute of Technology, Cambridge, MA, USA 
3  MIT Lincoln Laboratory, Lexington, MA, USA; Research Laboratory of Electronics, Massachusetts Institute of Technology, Cambridge, MA, USA; Department of Physics, Massachusetts Institute of Technology, Cambridge, MA, USA 
Pages
1-5
Publication year
2017
Publication date
Oct 2017
Publisher
Nature Publishing Group
e-ISSN
20566387
Source type
Scholarly Journal
Language of publication
English
DOI
https://doi.org/10.1038/s41534-017-0044-0
ProQuest document ID
1949066044
Copyright
© 2017. This work is published under http://creativecommons.org/licenses/by/4.0/ (the “License”). Notwithstanding the ProQuest Terms and Conditions, you may use this content in accordance with the terms of the License.