Abstract

Most existing methods for additive manufacturing (AM) of metals are inherently limited to ~20–50 μm resolution, which makes them untenable for generating complex 3D-printed metallic structures with smaller features. We developed a lithography-based process to create complex 3D nano-architected metals with ~100 nm resolution. We first synthesize hybrid organic–inorganic materials that contain Ni clusters to produce a metal-rich photoresist, then use two-photon lithography to sculpt 3D polymer scaffolds, and pyrolyze them to volatilize the organics, which produces a >90 wt% Ni-containing architecture. We demonstrate nanolattices with octet geometries, 2 μm unit cells and 300–400-nm diameter beams made of 20-nm grained nanocrystalline, nanoporous Ni. Nanomechanical experiments reveal their specific strength to be 2.1–7.2 MPa g−1 cm3, which is comparable to lattice architectures fabricated using existing metal AM processes. This work demonstrates an efficient pathway to 3D-print micro-architected and nano-architected metals with sub-micron resolution.

Details

Title
Additive manufacturing of 3D nano-architected metals
Author
Vyatskikh, Andrey 1   VIAFID ORCID Logo  ; Delalande, Stéphane 2 ; Kudo, Akira 1 ; Zhang, Xuan 3 ; Portela, Carlos M 1 ; Greer, Julia R 1 

 Division of Engineering and Applied Sciences, California Institute of Technology, Pasadena, CA, USA 
 Scientific Department, PSA Group, Centre Technique de Vélizy 2, route de Gizy, Vélizy-Villacoublay, France 
 Center of Advanced Mechanics and Materials, Department of Engineering Mechanics, Tsinghua University, Beijing, China 
Pages
1-8
Publication year
2018
Publication date
Feb 2018
Publisher
Nature Publishing Group
e-ISSN
20411723
Source type
Scholarly Journal
Language of publication
English
ProQuest document ID
2000016425
Copyright
© 2018. This work is published under http://creativecommons.org/licenses/by/4.0/ (the “License”). Notwithstanding the ProQuest Terms and Conditions, you may use this content in accordance with the terms of the License.