Abstract

Ultra-compact, densely integrated optical components manufactured on a CMOS-foundry platform are highly desirable for optical information processing and electronic-photonic co-integration. However, the large spatial extent of evanescent waves arising from nanoscale confinement, ubiquitous in silicon photonic devices, causes significant cross-talk and scattering loss. Here, we demonstrate that anisotropic all-dielectric metamaterials open a new degree of freedom in total internal reflection to shorten the decay length of evanescent waves. We experimentally show the reduction of cross-talk by greater than 30 times and the bending loss by greater than 3 times in densely integrated, ultra-compact photonic circuit blocks. Our prototype all-dielectric metamaterial-waveguide achieves a low propagation loss of approximately 3.7±1.0 dB/cm, comparable to those of silicon strip waveguides. Our approach marks a departure from interference-based confinement as in photonic crystals or slot waveguides, which utilize nanoscale field enhancement. Its ability to suppress evanescent waves without substantially increasing the propagation loss shall pave the way for all-dielectric metamaterial-based dense integration.

Details

Title
Controlling evanescent waves using silicon photonic all-dielectric metamaterials for dense integration
Author
Jahani, Saman 1   VIAFID ORCID Logo  ; Kim, Sangsik 2 ; Atkinson, Jonathan 3 ; Wirth, Justin C 4 ; Kalhor, Farid 1 ; Abdullah Al Noman 4 ; Newman, Ward D 1 ; Shekhar, Prashant 3   VIAFID ORCID Logo  ; Han, Kyunghun 4 ; Vien Van 3 ; DeCorby, Raymond G 3 ; Chrostowski, Lukas 5 ; Qi, Minghao 6 ; Jacob, Zubin 1 

 Department of Electrical and Computer Engineering, University of Alberta, Edmonton, Canada; School of Electrical and Computer Engineering and Birck Nanotechnology Center, Purdue University, West Lafayette, IN, USA 
 School of Electrical and Computer Engineering and Birck Nanotechnology Center, Purdue University, West Lafayette, IN, USA; Department of Electrical and Computer Engineering, Texas Tech University, Lubbock, TX, USA 
 Department of Electrical and Computer Engineering, University of Alberta, Edmonton, Canada 
 School of Electrical and Computer Engineering and Birck Nanotechnology Center, Purdue University, West Lafayette, IN, USA 
 Department of Electrical and Computer Engineering, University of British Columbia, Vancouver, BC, Canada 
 School of Electrical and Computer Engineering and Birck Nanotechnology Center, Purdue University, West Lafayette, IN, USA; Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences, Shanghai, China 
Pages
1-9
Publication year
2018
Publication date
May 2018
Publisher
Nature Publishing Group
e-ISSN
20411723
Source type
Scholarly Journal
Language of publication
English
ProQuest document ID
2038674422
Copyright
© 2018. This work is published under http://creativecommons.org/licenses/by/4.0/ (the “License”). Notwithstanding the ProQuest Terms and Conditions, you may use this content in accordance with the terms of the License.