Abstract

Adhesion in humid environments is fundamentally challenging because of the presence of interfacial bound water. Spiders often hunt in wet habitats and overcome this challenge using sticky aggregate glue droplets whose adhesion is resistant to interfacial failure under humid conditions. The mechanism by which spider aggregate glue avoids interfacial failure in humid environments is still unknown. Here, we investigate the mechanism of aggregate glue adhesion by using interface-sensitive spectroscopy in conjunction with infrared spectroscopy. We demonstrate that glycoproteins act as primary binding agents at the interface. As humidity increases, we observe reversible changes in the interfacial secondary structure of glycoproteins. Surprisingly, we do not observe liquid-like water at the interface, even though liquid-like water increases inside the bulk with increasing humidity. We hypothesize that the hygroscopic compounds in aggregate glue sequester interfacial water. Using hygroscopic compounds to sequester interfacial water provides a novel design principle for developing water-resistant synthetic adhesives.

Details

Title
Hygroscopic compounds in spider aggregate glue remove interfacial water to maintain adhesion in humid conditions
Author
Singla, Saranshu 1 ; Amarpuri, Gaurav 2 ; Dhopatkar, Nishad 3 ; Blackledge, Todd A 4 ; Dhinojwala, Ali 1   VIAFID ORCID Logo 

 Department of Polymer Science, The University of Akron, Akron, OH, United States 
 Department of Polymer Science, The University of Akron, Akron, OH, United States; Eastman Chemical Company, Corporate Analytical Division, Kingsport, TN, United States 
 Department of Polymer Science, The University of Akron, Akron, OH, United States; Avery Dennison Polymers, Adhesives and Coatings Center of Excellence, Mill Hall, PA, United States 
 Department of Biology, Integrated Bioscience Program, The University of Akron, Akron, OH, United States 
Pages
1-8
Publication year
2018
Publication date
May 2018
Publisher
Nature Publishing Group
e-ISSN
20411723
Source type
Scholarly Journal
Language of publication
English
ProQuest document ID
2042728281
Copyright
© 2018. This work is published under http://creativecommons.org/licenses/by/4.0/ (the “License”). Notwithstanding the ProQuest Terms and Conditions, you may use this content in accordance with the terms of the License.