Abstract

In this study, the effect of different composition of no-clean flux onto intermetallic compound (IMC) formation and growth was investigated. The solder joint between Sn-3Ag-0.5Cu solder alloy and printed circuit board (PCB) was made through reflow soldering. They were further aged at 125°C and 150°C for up to 1000 hours. Results showed that fluxes significantly affect the IMC thickness and growth. In addition, during aging, the scallop and columnar morphology of IMC changed to a more planar type for both type of flux during isothermal aging. It was observed that the growth behavior of IMC was closely related to initial soldering condition.

Details

Title
Effect of Flux onto Intermetallic Compound Formation and Growth
Author
Siti Rabiatull Aisha Idris; Farihan, Noor; Kahar, Hardinnawirda
Publication year
2016
Publication date
2016
Publisher
EDP Sciences
ISSN
22747214
e-ISSN
2261236X
Source type
Conference Paper
Language of publication
English
ProQuest document ID
2057235729
Copyright
© 2016. This work is licensed under http://creativecommons.org/licenses/by/4.0/ (the “License”). Notwithstanding the ProQuest Terms and conditions, you may use this content in accordance with the terms of the License.