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Abstract
High-entropy alloys (HEAs) are well known for their excellent high-temperature stability, mechanical properties, and promising resistance against oxidation and corrosion. However, their low-temperature applications are rarely studied, particularly in electronic packaging. In this study, the interfacial reaction between a Sn-3.0Ag-0.5Cu solder and FeCoNiCrCu0.5 HEA substrate was investigated. (Cu0.76, Ni0.24)6Sn5 intermetallic compound was formed the substrate at the interface between the solder and the FeCoNiCrCu0.5 HEA substrate. The average Sn grain size on the HEA substrate was 246 μm, which was considerably larger than that on a pure Cu substrate. The effect of the substrate on Sn grain size is due to the free energy required for the heterogeneous nucleation of Sn on the FeCoNiCrCu0.5 substrate.
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1 Osaka University, Joining and Welding Research Institute (JWRI), Ibaraki, Japan (GRID:grid.136593.b) (ISNI:0000 0004 0373 3971)
2 Minghsin University of Science and Technology, Department of Mechanical Engineering, Hsinchu, Taiwan (GRID:grid.440374.0) (ISNI:0000 0004 0639 3386); China University of Science and Technology, Department of Aviation Mechanical Engineering, Hsinchu, Taiwan (GRID:grid.418521.b) (ISNI:0000 0004 0638 8907)
3 City University of Hong Kong, Department of Electronic Engineering, Hong Kong, China (GRID:grid.35030.35) (ISNI:0000 0004 1792 6846); Osaka University, Joining and Welding Research Institute (JWRI), Ibaraki, Japan (GRID:grid.136593.b) (ISNI:0000 0004 0373 3971)
4 Osaka University, Graduate School of Engineering, Suita, Japan (GRID:grid.136593.b) (ISNI:0000 0004 0373 3971); Osaka University, Joining and Welding Research Institute (JWRI), Ibaraki, Japan (GRID:grid.136593.b) (ISNI:0000 0004 0373 3971)