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© 2019. This work is published under NOCC (the “License”). Notwithstanding the ProQuest Terms and Conditions, you may use this content in accordance with the terms of the License.

Abstract

In order to overcome the issues of rework and height difference in the manufacturing of smart devices, UV/UV stepwise curing was conducted on acrylate-based optically clear adhesives. Photo differential scanning calorimetry was used to confirm the results of curing of samples that were processed both with and without acrylic acid, over a range of UV light exposure times for a primary curing process. The samples processed at 0.6 J/cm2 of UV energy with and without acrylic acid showed the highest amount of residual monomers after primary curing. The amount of residual monomers observed in primary-cured samples decreased as the amount of UV light energy increased, from 0.9 to 1.5 J/cm2. After secondary curing, only the samples cured at 0.6 J/cm2 showed small amounts of residual monomers, while the samples exposed to other UV energies showed very few residual monomers, implying that these samples were completely cured during the secondary curing step. Adhesion properties were evaluated using peel and tack tests, while the viscoelastic properties of the samples were confirmed by dynamic mechanical analysis. Our results indicate that uniform physical properties were achieved after secondary curing. The effects of stepwise curing are demonstrated by the difference in gel fractions determined after primary and secondary curing.

Details

Title
UV/UV step-curing of optically clear acrylate adhesives for mobile devices
Author
Kim, J-S 1 ; Shim, G-S 1 ; Baek, D 1 ; Back, J-H 1 ; Jang, S-W 1 ; Kim, H-J; Choi, J-S; Yeom, J-S

 Laboratory of Adhesion and Bio-Composites, Program in Environmental Materials Science, Seoul National University, 08826 Seoul, Republic of Korea 
Pages
794-805
Publication year
2019
Publication date
Sep 2019
Publisher
Budapest University of Technology and Economics, Faculty of Mechanical Engineering, Department of Polymer Engineering
e-ISSN
1788618X
Source type
Scholarly Journal
Language of publication
English
ProQuest document ID
2277980277
Copyright
© 2019. This work is published under NOCC (the “License”). Notwithstanding the ProQuest Terms and Conditions, you may use this content in accordance with the terms of the License.