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© 2020. This work is published under NOCC (the “License”). Notwithstanding the ProQuest Terms and Conditions, you may use this content in accordance with the terms of the License.

Abstract

Void formation during in-plane flow has been widely researched, while the void prediction method for through-thickness flow has not been reported, which restricts the effective quality control for through-thickness permeating type liquid composite molding (LCM). In this paper, the structural morphology and connectivity of mesopores in multi-layer woven fabrics have been studied, the difference between intra-yarn and inter-yarn flow paths during through-thickness permeating has been analyzed, and the air entrapment processes in different types of mesopores have been revealed. Based on the modeling of micro and meso through-thickness flow, a mathematical model to predict the formation and size of mesoscale-void has been established, the variation of intra-yarn flow path under different compaction conditions has been analyzed to guarantee the precision of the model. Experimental method has been designed to measure the size of meso-scale-void formed during through-thickness LCM, comparisons between prediction and experimental results have demonstrated the correctness of the above model.

Details

Title
Modeling meso-scale-void formation during through-thickness flow in liquid composite molding
Author
Yang, B 1 ; Bi, F Y 2 ; Wang, S L 1 ; Ma, C 1 ; Wang, S B 1 ; Li, S

 Chongqing University, Chongqing, China 
 Heilongjiang Institute of Technology, Harbin, China 
Pages
77-89
Publication year
2020
Publication date
Jan 2020
Publisher
Budapest University of Technology and Economics, Faculty of Mechanical Engineering, Department of Polymer Engineering
e-ISSN
1788618X
Source type
Scholarly Journal
Language of publication
English
ProQuest document ID
2346712115
Copyright
© 2020. This work is published under NOCC (the “License”). Notwithstanding the ProQuest Terms and Conditions, you may use this content in accordance with the terms of the License.