Full text

Turn on search term navigation

© 2019. This work is published under http://creativecommons.org/licenses/by/4.0/ (the “License”). Notwithstanding the ProQuest Terms and Conditions, you may use this content in accordance with the terms of the License.

Abstract

Commercial metal oxide varistor devices are subject to nonuniformity, defects and coarse grain size, low working voltage, high leakage current, and mechanical cracking issues. This work tempted to make use of nanopowders and alternative sintering processes to achieve uniform microstructure and superior varistor performance. These nano‐enabled compositions exhibit lower sintering temperatures (650‐1050°C), smaller grain sizes (0.5‐2 μm), enhanced nonlinear coefficient (30‐130) in DC I‐V characteristics, higher varistor voltages (240‐2500 V/mm), and low leakage current (<1 μA/cm2). Conventional sintering offers highest nonlinearity. Spark plasma sintering and microwave sintering techniques show advantages in reducing grain sizes and sintering temperatures. Spark plasma sintering is particularly effective in achieving better varistor performance for the nano‐enabled MOV compositions after a post‐SPS sintering for sufficient oxygen diffusion. Microwave sintering needs higher sintering temperatures and additional research for the nano‐enabled MOV compositions to offer equivalent electrical properties.

Details

Title
Superior performing nano‐enabled metal oxide varistors
Author
Tan, Daniel Q 1   VIAFID ORCID Logo 

 Technion Israel Institute of Technology and Guangdong Technion Israel Institute of Technology, Shantou, China 
Pages
136-143
Section
ORIGINAL ARTICLES
Publication year
2019
Publication date
Oct 2019
Publisher
John Wiley & Sons, Inc.
e-ISSN
25783270
Source type
Scholarly Journal
Language of publication
English
ProQuest document ID
2347679324
Copyright
© 2019. This work is published under http://creativecommons.org/licenses/by/4.0/ (the “License”). Notwithstanding the ProQuest Terms and Conditions, you may use this content in accordance with the terms of the License.