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Abstract
Electrical contact is an essential issue for all devices. Although the contacts of the emergent two-dimensional materials have been extensively investigated, it is still challenging to produce excellent contacts. The face and edge type contacts have been applied previously, however a comparative study on the site-specific contact performances is lacking. Here we report an in situ transmission electron microscopy study on the contact properties with a series of 2D materials. By manipulating the contact configurations in real time, it is confirmed that, for 2D semiconductors the vdW type face contacts exhibit superior conductivity compared with the non-vdW type contacts. The direct quantum tunneling across the vdW bonded interfaces are virtually more favorable than the Fowler–Nordheim tunneling across chemically bonded interfaces for contacts. Meanwhile, remarkable area, thickness, geometry, and defect site dependences are revealed. Our work sheds light on the significance of contact engineering for 2D materials in future applications.
Here, the authors use in situ transmission electron microscopy to measure the interface properties of electrical contacts with MoS2, ReS2, and graphene, and find that direct quantum tunnelling across van-der-Waals-bonded interfaces is more favourable than Fowler–Nordheim tunnelling across chemically bonded interfaces.
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1 The Hong Kong Polytechnic University, Department of Applied Physics, Kowloon, China (GRID:grid.16890.36) (ISNI:0000 0004 1764 6123); Polytechnic University of Hong Kong Shenzhen Research Institute, Shenzhen, China (GRID:grid.194645.b) (ISNI:0000000121742757)
2 City University of Hong Kong, Department of Chemistry and Center of Super-Diamond & Advanced Films (COSDAF), Kowloon, China (GRID:grid.35030.35) (ISNI:0000 0004 1792 6846); City University of Hong Kong Shenzhen Research Institute, Shenzhen, China (GRID:grid.464255.4)
3 Huaiyin Normal University, Physics department and Jiangsu Key Laboratory for Chemistry of Low-Dimensional Materials, Huaian, China (GRID:grid.410738.9) (ISNI:0000 0004 1804 2567)