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© 2021. This work is published under http://creativecommons.org/licenses/by/4.0/ (the “License”). Notwithstanding the ProQuest Terms and Conditions, you may use this content in accordance with the terms of the License.

Abstract

It remains a daunting task to quantify the configurational entropy of a material from atom‐revolved electron microscopy images and correlate the results with the material's lattice thermal conductivity, which strides across statics, dynamics, and thermal transport of crystal lattice over orders of magnitudes in length and time. Here, a proof‐of‐principle study of atomic‐scale visualization and quantification of configurational entropy in relation to thermal conductivity in single crystalline trigonal GeSb2Te4 (aka t‐GeSb2Te4) with native atomic site disorder is reported. A concerted effort of large t‐GeSb2Te4 single crystal growth, in‐lab developed analysis procedure of atomic column intensity, the visualization and quantification of configurational entropy including corresponding modulation, and thermal transport measurements enable an entropic “bottom‐up” perspective to the lattice thermal conductivity of t‐GeSb2Te4. It is uncovered that the configurational entropy increases phonon scattering and reduces phonon mean free path as well as promotes anharmonicity, thereby giving rise to low lattice thermal conductivity and promising thermoelectric performance. The current study sheds lights on an atomic scale bottom‐up configurational entropy design in diverse regimes of structural and functional materials research and applications.

Details

Title
Atomic‐Scale Visualization and Quantification of Configurational Entropy in Relation to Thermal Conductivity: A Proof‐of‐Principle Study in t ‐GeSb 2 Te 4
Author
Chen, Yongjin 1 ; Zhang, Bin 2 ; Zhang, Yongsheng 3 ; Wu, Hong 4 ; Peng, Kunling 4 ; Yang, Hengquan 4 ; Zhang, Qing 5 ; Liu, Xiaopeng 6 ; Chai, Yisheng 4 ; Xu, Lu 4 ; Wang, Guoyu 7 ; Zhang, Ze 8 ; He, Jian 9 ; Han, Xiaodong 5 ; Zhou, Xiaoyuan 10   VIAFID ORCID Logo 

 College of Physics and Center for Quantum Materials and Devices, Institute of Advanced Interdisciplinary Studies, Chongqing University, Chongqing, P. R. China; Beijing Key Laboratory and Institute of Microstructure and Property of Advanced Materials, Beijing University of Technology, Beijing, P. R. China; Center for High Pressure Science and Technology Advanced Research, Beijing, P. R. China 
 Analytical and Testing Center, Chongqing University, Chongqing, P. R. China 
 Key Laboratory of Materials Physics, Institute of Solid State Physics, Chinese Academy of Sciences, Hefei, P. R. China; Science Island Branch of Graduate School, University of Science and Technology of China, Hefei, P. R. China 
 College of Physics and Center for Quantum Materials and Devices, Institute of Advanced Interdisciplinary Studies, Chongqing University, Chongqing, P. R. China 
 Beijing Key Laboratory and Institute of Microstructure and Property of Advanced Materials, Beijing University of Technology, Beijing, P. R. China 
 College of Physics and Center for Quantum Materials and Devices, Institute of Advanced Interdisciplinary Studies, Chongqing University, Chongqing, P. R. China; Key Laboratory of Materials Physics, Institute of Solid State Physics, Chinese Academy of Sciences, Hefei, P. R. China; Science Island Branch of Graduate School, University of Science and Technology of China, Hefei, P. R. China 
 Chongqing Institute of Green and Intelligent Technology, Chinese Academy of Sciences, Chongqing, P. R. China; University of Chinese Academy of Sciences, Beijing, P. R. China 
 Beijing Key Laboratory and Institute of Microstructure and Property of Advanced Materials, Beijing University of Technology, Beijing, P. R. China; Center of Electron Microscopy and State Key Laboratory of Silicon Materials, Department of Materials Science and Engineering, Zhejiang University, Hangzhou, P. R. China 
 Department of Physics and Astronomy, Clemson University, Clemson, SC, USA 
10  College of Physics and Center for Quantum Materials and Devices, Institute of Advanced Interdisciplinary Studies, Chongqing University, Chongqing, P. R. China; Analytical and Testing Center, Chongqing University, Chongqing, P. R. China 
Section
Communications
Publication year
2021
Publication date
Apr 2021
Publisher
John Wiley & Sons, Inc.
e-ISSN
21983844
Source type
Scholarly Journal
Language of publication
English
ProQuest document ID
2516201851
Copyright
© 2021. This work is published under http://creativecommons.org/licenses/by/4.0/ (the “License”). Notwithstanding the ProQuest Terms and Conditions, you may use this content in accordance with the terms of the License.