Abstract

With the rapid development of the Internet of Things (IoT) and the emergence of 5G, traditional silicon-based electronics no longer fully meet market demands such as nonplanar application scenarios due to mechanical mismatch. This provides unprecedented opportunities for flexible electronics that bypass the physical rigidity through the introduction of flexible materials. In recent decades, biological materials with outstanding biocompatibility and biodegradability, which are considered some of the most promising candidates for next-generation flexible electronics, have received increasing attention, e.g., silk fibroin, cellulose, pectin, chitosan, and melanin. Among them, silk fibroin presents greater superiorities in biocompatibility and biodegradability, and moreover, it also possesses a variety of attractive properties, such as adjustable water solubility, remarkable optical transmittance, high mechanical robustness, light weight, and ease of processing, which are partially or even completely lacking in other biological materials. Therefore, silk fibroin has been widely used as fundamental components for the construction of biocompatible flexible electronics, particularly for wearable and implantable devices. Furthermore, in recent years, more attention has been paid to the investigation of the functional characteristics of silk fibroin, such as the dielectric properties, piezoelectric properties, strong ability to lose electrons, and sensitivity to environmental variables. Here, this paper not only reviews the preparation technologies for various forms of silk fibroin and the recent progress in the use of silk fibroin as a fundamental material but also focuses on the recent advanced works in which silk fibroin serves as functional components. Additionally, the challenges and future development of silk fibroin-based flexible electronics are summarized.

Details

Title
Recent progress in silk fibroin-based flexible electronics
Author
Dan-Liang, Wen 1 ; De-Heng, Sun 1 ; Huang, Peng 1 ; Huang, Wen 1 ; Su, Meng 2 ; Wang, Ya 3 ; Meng-Di, Han 4 ; Kim Beomjoon 2   VIAFID ORCID Logo  ; Brugger Juergen 3 ; Hai-Xia, Zhang 4 ; Xiao-Sheng, Zhang 1   VIAFID ORCID Logo 

 University of Electronic Science and Technology of China, School of Electronic Science and Engineering, Chengdu, China (GRID:grid.54549.39) (ISNI:0000 0004 0369 4060) 
 The University of Tokyo, CIRMM, Institute of Industrial Science, Tokyo, Japan (GRID:grid.26999.3d) (ISNI:0000 0001 2151 536X) 
 Microsystems Laboratory, École Polytechnique Fédérale de Lausanne (EPFL), Lausanne, Switzerland (GRID:grid.5333.6) (ISNI:0000000121839049) 
 Peking University, Institute of Microelectronics, Beijing, China (GRID:grid.11135.37) (ISNI:0000 0001 2256 9319) 
Publication year
2021
Publication date
2021
Publisher
Springer Nature B.V.
ISSN
20961030
e-ISSN
20557434
Source type
Scholarly Journal
Language of publication
English
ProQuest document ID
2522497767
Copyright
© The Author(s) 2021. This work is published under http://creativecommons.org/licenses/by/4.0/ (the “License”). Notwithstanding the ProQuest Terms and Conditions, you may use this content in accordance with the terms of the License.