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© 2019 by the authors. Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (http://creativecommons.org/licenses/by/4.0/). Notwithstanding the ProQuest Terms and Conditions, you may use this content in accordance with the terms of the License.

Abstract

In this paper, we propose a novel, miniaturized non-dispersive infrared (NDIR) CO2 sensor implemented on a silicon chip. The sensor has a simple structure, consisting of a hollow metallic cylindrical cavity along with access waveguides. A detailed analysis of the proposed sensor is presented. Simulation with 3D ray tracing shows that an integrating cylinder with 4 mm diameter gives an equivalent optical path length of 3.5 cm. The sensor is fabricated using Deep Reactive Ion Etching (DRIE) and wafer bonding. The fabricated sensor was evaluated by performing a CO2 concentration measurement, showing a limit of detection of ∼100 ppm. The response time of the sensor is only ∼2.8 s, due to its small footprint. The use of DRIE-based waveguide structures enables mass fabrication, as well as the potential co-integration of flip-chip integrated midIR light-emitting diodes (LEDs) and photodetectors, resulting in a compact, low-power, and low-cost NDIR CO2 sensor.

Details

Title
On-Chip Non-Dispersive Infrared CO2 Sensor Based on an Integrating Cylinder
Author
Jia, Xiaoning 1 ; Roels, Joris 2 ; Baets, Roel 1 ; Roelkens, Gunther 1   VIAFID ORCID Logo 

 Photonics Research Group, INTEC, Ghent University-imec, Technologiepark 126, 9052 Gent, Belgium; Center for Nano- and Biophotonics, Ghent University, 9000 Gent, Belgium 
 Melexis Technologies NV, Transportstraat 1, 3980 Tessenderlo, Belgium 
First page
4260
Publication year
2019
Publication date
2019
Publisher
MDPI AG
e-ISSN
14248220
Source type
Scholarly Journal
Language of publication
English
ProQuest document ID
2535573364
Copyright
© 2019 by the authors. Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (http://creativecommons.org/licenses/by/4.0/). Notwithstanding the ProQuest Terms and Conditions, you may use this content in accordance with the terms of the License.