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© 2021 by the authors. Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (https://creativecommons.org/licenses/by/4.0/). Notwithstanding the ProQuest Terms and Conditions, you may use this content in accordance with the terms of the License.

Abstract

Microstructure dependence of effective thermal conductivity of the coating was investigated to optimize the thermal insulation of columnar structure electron beam physical vapor deposition (EB-PVD coating), considering constraints by mechanical stress. First, a three-dimensional finite element model of multiple columnar structure was established to involve thermal contact resistance across the interfaces between the adjacent columnar structures. Then, the mathematical formula of each structural parameter was derived to demonstrate the numerical outcome and predict the effective thermal conductivity. After that, the heat conduction characteristics of the columnar structured coating was analyzed to reveal the dependence of the effective thermal conductivity of the thermal barrier coatings (TBCs) on its microstructure characteristics, including the column diameter, the thickness of coating, the ratio of the height of fine column to coarse column and the inclination angle of columns. Finally, the influence of each microstructural parameter on the mechanical stress of the TBCs was studied by a mathematic model, and the optimization of the inclination angle was proposed, considering the thermal insulation and mechanical stress of the coating.

Details

Title
Microstructure Dependence of Effective Thermal Conductivity of EB-PVD TBCs
Author
Shi-Yi, Qiu 1   VIAFID ORCID Logo  ; Chen-Wu, Wu 2 ; Chen-Guang, Huang 2 ; Ma, Yue 3   VIAFID ORCID Logo  ; Hong-Bo, Guo 3 

 Beijing Key Laboratory for Advanced Functional Material and Thin Film Technology, School of Materials Science and Engineering, Beihang University (BUAA), Beijing 100191, China; [email protected] (S.-Y.Q.); [email protected] (H.-B.G.); Institute of Mechanics, Chinese Academy of Sciences, Beijing 100190, China; [email protected] 
 Institute of Mechanics, Chinese Academy of Sciences, Beijing 100190, China; [email protected] 
 Beijing Key Laboratory for Advanced Functional Material and Thin Film Technology, School of Materials Science and Engineering, Beihang University (BUAA), Beijing 100191, China; [email protected] (S.-Y.Q.); [email protected] (H.-B.G.) 
First page
1838
Publication year
2021
Publication date
2021
Publisher
MDPI AG
e-ISSN
19961944
Source type
Scholarly Journal
Language of publication
English
ProQuest document ID
2548721652
Copyright
© 2021 by the authors. Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (https://creativecommons.org/licenses/by/4.0/). Notwithstanding the ProQuest Terms and Conditions, you may use this content in accordance with the terms of the License.