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© 2019 by the authors. Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (http://creativecommons.org/licenses/by/4.0/). Notwithstanding the ProQuest Terms and Conditions, you may use this content in accordance with the terms of the License.

Abstract

Micron Ti metal particles were incorporated into SiCp/7075Al composites using pressure infiltration. The interface structure between the Ti metal particles and the matrix during the casting processes were investigated. Results show that the dispersed unreacted Ti particles form mutual diffusion layer at the interface without the formation of low-temperature intermetallic phases during the solidification processes. The interaction between the micron Ti and the molten aluminum alloy is subject to the mutual diffusion coefficient of Ti–Al rather than the reaction activation energy. The tensile strength and plasticity of the composite were improved simultaneously due to the high interfacial bonding strength and released thermal misfit stress cause by the incorporated Ti metal particles.

Details

Title
Interface Structure and Mechanical Properties of 7075Al Hybrid Composite Reinforced with Micron Ti Metal Particles Using Pressure Infiltration
Author
Liu, Yixiong 1 ; Zheng, Zhenxing 2 ; Cao, Genghua 2 ; Zhu, Dezhi 3 ; Yang, Chao 3 ; Luo, Mingqiang 4 

 School of Mechanical and Electronic Engineering, Guangdong Polytechnic Normal University, Guangzhou 510665, China; Guangdong Key Laboratory for Advanced Metallic Materials processing, South China University of Technology, Guangzhou 510640, China 
 School of Mechanical and Electronic Engineering, Guangdong Polytechnic Normal University, Guangzhou 510665, China 
 Guangdong Key Laboratory for Advanced Metallic Materials processing, South China University of Technology, Guangzhou 510640, China 
 National Enterprise Technology Center, Guangdong Xingfa Aluminum (jiangxi) Co. Ltd., Yichun 336000, China 
First page
763
Publication year
2019
Publication date
2019
Publisher
MDPI AG
e-ISSN
20754701
Source type
Scholarly Journal
Language of publication
English
ProQuest document ID
2548830020
Copyright
© 2019 by the authors. Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (http://creativecommons.org/licenses/by/4.0/). Notwithstanding the ProQuest Terms and Conditions, you may use this content in accordance with the terms of the License.