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© 2019 by the authors. Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (http://creativecommons.org/licenses/by/4.0/). Notwithstanding the ProQuest Terms and Conditions, you may use this content in accordance with the terms of the License.

Abstract

Passive multi-frequency microwave remote sensing is often plagued with the problems of low- and non-uniform spatial resolution. In order to adaptively enhance and match the spatial resolution, an accommodative spatial resolution matching (ASRM) framework, composed of the flexible degradation model, the deep residual convolutional neural network (CNN), and the adaptive feature modification (AdaFM) layers, is proposed in this paper. More specifically, a flexible degradation model, based on the imaging process of the microwave radiometer, is firstly proposed to generate suitable datasets for various levels of matching tasks. Secondly, a deep residual CNN is introduced to jointly learn the complicated degradation factors of the data, so that the resolution can be matched up to fixed levels with state of the art quality. Finally, the AdaFM layers are added to the network in order to handle arbitrary and continuous resolution matching problems between a start and an end level. Both the simulated and the microwave radiation imager (MWRI) data from the Fengyun-3C (FY-3C) satellite have been used to demonstrate the validity and the effectiveness of the method.

Details

Title
Spatial Resolution Matching of Microwave Radiometer Data with Convolutional Neural Network
Author
Li, Yade 1 ; Hu, Weidong 1 ; Chen, Shi 1 ; Zhang, Wenlong 2 ; Guo, Rui 3 ; He, Jingwen 2 ; Ligthart, Leo 4   VIAFID ORCID Logo 

 Beijing Key Laboratory of Millimeter Wave and Terahertz Technology, Beijing Institute of Technology, Beijing 100081, China; [email protected] (Y.L.); [email protected] (S.C.) 
 Shenzhen Institutes of Advanced Technology, Chinese Academy of Sciences, Shenzhen 518000, China; [email protected] (W.Z.); [email protected] (J.H.) 
 Department of Electronic Engineering, Tsinghua University, Beijing 100084, China; [email protected] 
 Faculty of Electrical Engineering, Delft University of Technology, 2600 GA Delft, The Netherlands; [email protected] 
First page
2432
Publication year
2019
Publication date
2019
Publisher
MDPI AG
e-ISSN
20724292
Source type
Scholarly Journal
Language of publication
English
ProQuest document ID
2550291685
Copyright
© 2019 by the authors. Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (http://creativecommons.org/licenses/by/4.0/). Notwithstanding the ProQuest Terms and Conditions, you may use this content in accordance with the terms of the License.