Full text

Turn on search term navigation

© 2021 by the authors. Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (https://creativecommons.org/licenses/by/4.0/). Notwithstanding the ProQuest Terms and Conditions, you may use this content in accordance with the terms of the License.

Abstract

In an attempt to incorporate tin (Sn) into high-entropy alloys composed of refractory metals Hf, Nb, Ti and Zr with the addition of 3d transition metals Cu, Fe, and Ni, we synthesized a series of alloys in the system HfTiZrSnM (M = Cu, Fe, Nb, Ni). The alloys were characterized crystallographically, microstructurally, and compositionally, and their physical properties were determined, with the emphasis on superconductivity. All Sn-containing alloys are multi-phase mixtures of intermetallic compounds (in most cases four). A common feature of the alloys is a microstructure of large crystalline grains of a hexagonal (Hf, Ti, Zr)5Sn3 partially ordered phase embedded in a matrix that also contains many small inclusions. In the HfTiZrSnCu alloy, some Cu is also incorporated into the grains. Based on the electrical resistivity, specific heat, and magnetization measurements, a superconducting (SC) state was observed in the HfTiZr, HfTiZrSn, HfTiZrSnNi, and HfTiZrSnNb alloys. The HfTiZrSnFe alloy shows a partial SC transition, whereas the HfTiZrSnCu alloy is non-superconducting. All SC alloys are type II superconductors and belong to the Anderson class of “dirty” superconductors.

Details

Title
Structure and Superconductivity of Tin-Containing HfTiZrSnM (M = Cu, Fe, Nb, Ni) Medium-Entropy and High-Entropy Alloys
Author
Gačnik, Darja 1   VIAFID ORCID Logo  ; Jelen, Andreja 1 ; Krnel, Mitja 1   VIAFID ORCID Logo  ; Vrtnik, Stanislav 1   VIAFID ORCID Logo  ; Luzar, Jože 1 ; Koželj, Primož 2   VIAFID ORCID Logo  ; Marion van Midden 1 ; Zupanič, Erik 1   VIAFID ORCID Logo  ; Wencka, Magdalena 3   VIAFID ORCID Logo  ; Meden, Anton 4 ; Hu, Qiang 5 ; Guo, Sheng 6   VIAFID ORCID Logo  ; Dolinšek, Janez 2   VIAFID ORCID Logo 

 Jožef Stefan Institute, Jamova 39, SI-1000 Ljubljana, Slovenia; [email protected] (D.G.); [email protected] (A.J.); [email protected] (M.K.); [email protected] (S.V.); [email protected] (J.L.); [email protected] (P.K.); [email protected] (M.v.M.); [email protected] (E.Z.); [email protected] (M.W.) 
 Jožef Stefan Institute, Jamova 39, SI-1000 Ljubljana, Slovenia; [email protected] (D.G.); [email protected] (A.J.); [email protected] (M.K.); [email protected] (S.V.); [email protected] (J.L.); [email protected] (P.K.); [email protected] (M.v.M.); [email protected] (E.Z.); [email protected] (M.W.); Faculty of Mathematics and Physics, University of Ljubljana, Jadranska 19, SI-1000 Ljubljana, Slovenia 
 Jožef Stefan Institute, Jamova 39, SI-1000 Ljubljana, Slovenia; [email protected] (D.G.); [email protected] (A.J.); [email protected] (M.K.); [email protected] (S.V.); [email protected] (J.L.); [email protected] (P.K.); [email protected] (M.v.M.); [email protected] (E.Z.); [email protected] (M.W.); Institute of Molecular Physics, Polish Academy of Sciences, Smoluchowskiego 17, PL-60-179 Poznań, Poland 
 Faculty of Chemistry and Chemical Technology, University of Ljubljana, Večna Pot 113, SI-1000 Ljubljana, Slovenia; [email protected] 
 Institute of Applied Physics, Jiangxi Academy of Sciences, Changdong Road 7777, Nanchang 330096, China 
 Industrial and Materials Science, Chalmers University of Technology, SE-41296 Göteborg, Sweden; [email protected] 
First page
3953
Publication year
2021
Publication date
2021
Publisher
MDPI AG
e-ISSN
19961944
Source type
Scholarly Journal
Language of publication
English
ProQuest document ID
2554605784
Copyright
© 2021 by the authors. Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (https://creativecommons.org/licenses/by/4.0/). Notwithstanding the ProQuest Terms and Conditions, you may use this content in accordance with the terms of the License.