Abstract

The development of the resistive switching cross-point array as the next-generation platform for high-density storage, in-memory computing and neuromorphic computing heavily relies on the improvement of the two component devices, volatile selector and nonvolatile memory, which have distinct operating current requirements. The perennial current-volatility dilemma that has been widely faced in various device implementations remains a major bottleneck. Here, we show that the device based on electrochemically active, low-thermal conductivity and low-melting temperature semiconducting tellurium filament can solve this dilemma, being able to function as either selector or memory in respective desired current ranges. Furthermore, we demonstrate one-selector-one-resistor behavior in a tandem of two identical Te-based devices, indicating the potential of Te-based device as a universal array building block. These nonconventional phenomena can be understood from a combination of unique electrical-thermal properties in Te. Preliminary device optimization efforts also indicate large and unique design space for Te-based resistive switching devices.

Resistive switching devices have great promise for a wide variety of technological applications. Here, Yang et al demonstrate that electrochemically induced tellurium filament can give rise to resistive switching, and show that devices based on this can provide a number of advantages compared to metallic filament-based devices.

Details

Title
A new opportunity for the emerging tellurium semiconductor: making resistive switching devices
Author
Yang, Yifei 1   VIAFID ORCID Logo  ; Xu Mingkun 1 ; Jia Shujing 2 ; Wang Bolun 3 ; Xu Lujie 4   VIAFID ORCID Logo  ; Wang, Xinxin 1 ; Liu, Huan 5 ; Liu Yuanshuang 5 ; Guo Yuzheng 6   VIAFID ORCID Logo  ; Wang, Lidan 7 ; Duan Shukai 8 ; Liu, Kai 3   VIAFID ORCID Logo  ; Zhu, Min 9   VIAFID ORCID Logo  ; Pei Jing 1 ; Duan Wenrui 4 ; Liu Dameng 5 ; Li Huanglong 10   VIAFID ORCID Logo 

 Tsinghua University, Department of Precision Instrument, Center for Brain Inspired Computing Research, Beijing, China (GRID:grid.12527.33) (ISNI:0000 0001 0662 3178) 
 Fudan University, Frontier Institute of Chip and System, Shanghai, China (GRID:grid.8547.e) (ISNI:0000 0001 0125 2443); Chinese Academy of Sciences, State Key Laboratory of Functional Materials for Informatics, Shanghai Institute of Micro-System and Information Technology, Shanghai, China (GRID:grid.9227.e) (ISNI:0000000119573309) 
 Tsinghua University, State Key Laboratory of New Ceramics and Fine Processing, School of Materials Science and Engineering, Beijing, China (GRID:grid.12527.33) (ISNI:0000 0001 0662 3178) 
 Beijing Information Science & Technology University, School of Instrument Science and Opto Electronics Engineering, Beijing, China (GRID:grid.443248.d) (ISNI:0000 0004 0467 2584) 
 Tsinghua University, State Key Laboratory of Tribology, Beijing, China (GRID:grid.12527.33) (ISNI:0000 0001 0662 3178) 
 Swansea University, College of Engineering, Swansea, UK (GRID:grid.4827.9) (ISNI:0000 0001 0658 8800) 
 Southwest University, School of Electronic and Information Engineering, Chongqing, China (GRID:grid.263906.8) (ISNI:0000 0001 0362 4044) 
 Southwest University, School of Artificial Intelligence, Chongqing, China (GRID:grid.263906.8) (ISNI:0000 0001 0362 4044) 
 Chinese Academy of Sciences, State Key Laboratory of Functional Materials for Informatics, Shanghai Institute of Micro-System and Information Technology, Shanghai, China (GRID:grid.9227.e) (ISNI:0000000119573309) 
10  Tsinghua University, Department of Precision Instrument, Center for Brain Inspired Computing Research, Beijing, China (GRID:grid.12527.33) (ISNI:0000 0001 0662 3178); Chinese Institute for Brain Research, Beijing, China (GRID:grid.510934.a) 
Publication year
2021
Publication date
2021
Publisher
Nature Publishing Group
e-ISSN
20411723
Source type
Scholarly Journal
Language of publication
English
ProQuest document ID
2583223142
Copyright
© The Author(s) 2021. This work is published under http://creativecommons.org/licenses/by/4.0/ (the “License”). Notwithstanding the ProQuest Terms and Conditions, you may use this content in accordance with the terms of the License.