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Copyright © 2022 M. Feroskhan et al. This is an open access article distributed under the Creative Commons Attribution License (the “License”), which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited. Notwithstanding the ProQuest Terms and Conditions, you may use this content in accordance with the terms of the License. https://creativecommons.org/licenses/by/4.0/

Abstract

Understanding thermophoresis in nanorefrigerants stands challenging for a long period despite the phenomenon is attributed for the motion dynamics of particles in nanofluids. Influence of thermophoretic mobility of copper-oxide nanoparticles on the heat transfer behavior of isobutane (R600a) refrigerant is reported in this work. Pool boiling of the isobutane/copper-oxide nanofluid is numerically simulated in computational fluid dynamics utilizing both single and two-phase approaches. Mobility of particles in the saturated refrigerant is studied, and the time scales associated with (Brownian and momentum) diffusions are numerically solved. The temperature contour of the liquid pool is validated with the experimental data, and the properties of the nanorefrigerant such as thermal conductivity, viscosity, and specific heat are estimated in ANSYS Fluent. 5% increase in thermal conductivity and marginal reduction in specific heat of the nanorefrigerant for 0.01% volume fraction of copper-oxide nanoparticles is witnessed. Mobility of particles due to temperature gradient is found higher near the heater; however, thermophoretic velocity is predicted to be lower because of the narrow temperature gradient. Numerical results showed that the time scale for momentum diffusion is shorter (in the order of e+03) than Brownian diffusion, and hence the momentum diffusion is found to be the predominant mode of heat transfer in nanorefrigerant.

Details

Title
Effect of Thermophoresis on Heat Diffusion in Isobutane/Copper-Oxide Nanofluid under Pool Boiling Condition: Numerical Investigation
Author
Feroskhan, M 1   VIAFID ORCID Logo  ; Venugopal, T 1   VIAFID ORCID Logo  ; Naif Mana Almakayeel 2   VIAFID ORCID Logo  ; Yunus Khan, T M 3   VIAFID ORCID Logo  ; Shaik Dawood Abdul Khadar 2   VIAFID ORCID Logo  ; Gobinath, N 1   VIAFID ORCID Logo 

 School of Mechanical Engineering, Vellore Institute of Technology-Chennai, 600127, India 
 Industrial Engineering Department, King Khalid University, 61421, Saudi Arabia 
 Department of Mechanical Engineering, King Khalid University, 61421, Saudi Arabia 
Editor
Samson Jerold Samuel Chelladurai
Publication year
2022
Publication date
2022
Publisher
John Wiley & Sons, Inc.
ISSN
16874110
e-ISSN
16874129
Source type
Scholarly Journal
Language of publication
English
ProQuest document ID
2651402298
Copyright
Copyright © 2022 M. Feroskhan et al. This is an open access article distributed under the Creative Commons Attribution License (the “License”), which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited. Notwithstanding the ProQuest Terms and Conditions, you may use this content in accordance with the terms of the License. https://creativecommons.org/licenses/by/4.0/