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Abstract
Low-temperature decomposition of supersaturated solid solution into unfavorable intergranular precipitates is a long-standing bottleneck limiting the practical applications of nanograined aluminum alloys that are prepared by severe plastic deformation. Minimizing the vacancy concentration is generally regarded as an effective approach in suppressing the decomposition process. Here we report a counterintuitive strategy to stabilize supersaturated solid solution in nanograined Al-Cu alloys via high-density vacancies in combination with Sc microalloying. By generating a two orders of magnitude higher concentration of vacancies bonded in strong (Cu, Sc, vacancy)-rich atomic complexes, a high thermal stability is achieved in an Al-Cu-Sc alloy that precipitation is nearly suppressed up to ~230 °C. The solute-vacancy complexes also enable the nanograined Al-Cu alloys with higher strength, greater strain hardening capability and ductility. These findings provide perspectives towards the great potentials of solute-vacancy interaction and the development of nanograined alloys with high stability and well-performed mechanical properties.
Low-temperature decomposition and insufficient plastic deformability are bottlenecks that limit the practical applications of nanograined Al alloys. Here the authors utilize a high density vacancies in combination with Sc microalloying to stabilize nanograined Al-Cu alloys.
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1 Xi’an Jiaotong University, State Key Laboratory for Mechanical Behavior of Materials, School of Materials Science and Engineering, Xi’an, China (GRID:grid.43169.39) (ISNI:0000 0001 0599 1243)
2 Norwegian University of Science and Technology, Department of Materials Science and Engineering, Trondheim, Norway (GRID:grid.5947.f) (ISNI:0000 0001 1516 2393)
3 School of Physical Science and Technology and Electron Microscopy Centre of Lanzhou University, Lanzhou University, Key Laboratory of Magnetism and Magnetic Materials of the Ministry of Education, Lanzhou, China (GRID:grid.32566.34) (ISNI:0000 0000 8571 0482)
4 University of Padova, Via Gradenigo 6/a, Department of Industrial Engineering, Padua, Italy (GRID:grid.5608.b) (ISNI:0000 0004 1757 3470)