Chemical deposition of Cu2O films with ultra-low resistivity: correlation with the defect landscape

Abstract

Cuprous oxide (Cu₂O) is a promising p-type semiconductor material for many applications. So far, the lowest resistivity values are obtained for films deposited by physical methods and/or at high temperatures (~1000 °C), limiting their mass integration. Here, Cu₂O thin films with ultra-low resistivity values of 0.4 Ω.cm were deposited at only 260 °C by atmospheric pressure spatial atomic layer deposition, a scalable chemical approach. The carrier concentration (7.10¹⁴−2.10¹⁸ cm⁻³), mobility (1–86 cm²/V.s), and optical bandgap (2.2–2.48 eV) are easily tuned by adjusting the fraction of oxygen used during deposition. The properties of the films are correlated to the defect landscape, as revealed by a combination of techniques (positron annihilation spectroscopy (PAS), Raman spectroscopy and photoluminescence). Our results reveal the existence of large complex defects and the decrease of the overall defect concentration in the films with increasing oxygen fraction used during deposition.

Cu₂O offers a lot of potential for several optoelectronic applications. Here, the authors present a low temperature, fast and scalable approach to deposit Cu₂O films with low resistivity, which is correlated to the defect landscape in the material.