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Abstract
Recent advancements in integrated soliton microcombs open the route to a wide range of chip-based communication, sensing, and metrology applications. The technology translation from laboratory demonstrations to real-world applications requires the fabrication process of photonics chips to be fully CMOS-compatible, such that the manufacturing can take advantage of the ongoing evolution of semiconductor technology at reduced cost and with high volume. Silicon nitride has become the leading CMOS platform for integrated soliton devices, however, it is an insulator and lacks intrinsic second-order nonlinearity for electro-optic modulation. Other materials have emerged such as AlN, LiNbO3, AlGaAs and GaP that exhibit simultaneous second- and third-order nonlinearities. Here, we show that silicon carbide (SiC) -- already commercially deployed in nearly ubiquitous electrical power devices such as RF electronics, MOSFET, and MEMS due to its wide bandgap properties, excellent mechanical properties, piezoelectricity and chemical inertia -- is a new competitive CMOS-compatible platform for nonlinear photonics. High-quality-factor microresonators (Q = 4 × 106) are fabricated on 4H-SiC-on-insulator thin films, where a single soliton microcomb is generated. In addition, we observe wide spectral translation of chaotic microcombs from near-infrared to visible due to the second-order nonlinearity of SiC. Our work highlights the prospects of SiC for future low-loss integrated nonlinear and quantum photonics that could harness electro-opto-mechanical interactions on a monolithic platform.
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1 Chinese Academy of Sciences, State Key Laboratory of Functional Materials for Informatics, Shanghai Institute of Microsystem and Information Technology, Shanghai, China (GRID:grid.9227.e) (ISNI:0000000119573309); University of Chinese Academy of Sciences, The Center of Materials Science and Optoelectronics Engineering, Beijing, China (GRID:grid.410726.6) (ISNI:0000 0004 1797 8419)
2 University of Science and Technology of China, CAS Key Laboratory of Quantum Information, Hefei, China (GRID:grid.59053.3a) (ISNI:0000000121679639); University of Science and Technology of China, CAS Center for Excellence in Quantum Information and Quantum Physics, Hefei, China (GRID:grid.59053.3a) (ISNI:0000000121679639)
3 Chinese Academy of Sciences, State Key Laboratory of Functional Materials for Informatics, Shanghai Institute of Microsystem and Information Technology, Shanghai, China (GRID:grid.9227.e) (ISNI:0000000119573309)
4 East China Normal University, The Extreme Optoelectromechanics Laboratory (XXL), School of Physics and Electronic Science, Shanghai, China (GRID:grid.22069.3f) (ISNI:0000 0004 0369 6365)
5 University of Chinese Academy of Sciences, The Center of Materials Science and Optoelectronics Engineering, Beijing, China (GRID:grid.410726.6) (ISNI:0000 0004 1797 8419); East China Normal University, The Extreme Optoelectromechanics Laboratory (XXL), School of Physics and Electronic Science, Shanghai, China (GRID:grid.22069.3f) (ISNI:0000 0004 0369 6365)
6 East China Normal University, The Extreme Optoelectromechanics Laboratory (XXL), School of Physics and Electronic Science, Shanghai, China (GRID:grid.22069.3f) (ISNI:0000 0004 0369 6365); Chinese Academy of Sciences, State Key Laboratory of High Field Laser Physics and CAS Center for Excellence in Ultra-intense Laser Science, Shanghai Institute of Optics and Fine Mechanics, Shanghai, China (GRID:grid.9227.e) (ISNI:0000000119573309)
7 International Quantum Academy, Shenzhen, China (GRID:grid.9227.e); University of Science and Technology of China, Hefei National Laboratory, Hefei, China (GRID:grid.59053.3a) (ISNI:0000000121679639)