It appears you don't have support to open PDFs in this web browser. To view this file, Open with your PDF reader
Abstract
Modular Multilevel Converter (MMC) is widely used in flexible HVDC transmission systems, IGBT module as its core power device, its failure process seriously affects the operation reliability of MMC. The high junction temperature is an important reason for the failure of the IGBT module, so monitoring the junction temperature of IGBT module is an important means to ensure the stable operation of the system. According to the topological structure of IGBT module, the current junction temperature monitoring methods of IGBT module are summarized and compared. According to the shortcomings of the current research and the current research status, the research direction of IGBT module junction temperature monitoring is prospected.
You have requested "on-the-fly" machine translation of selected content from our databases. This functionality is provided solely for your convenience and is in no way intended to replace human translation. Show full disclaimer
Neither ProQuest nor its licensors make any representations or warranties with respect to the translations. The translations are automatically generated "AS IS" and "AS AVAILABLE" and are not retained in our systems. PROQUEST AND ITS LICENSORS SPECIFICALLY DISCLAIM ANY AND ALL EXPRESS OR IMPLIED WARRANTIES, INCLUDING WITHOUT LIMITATION, ANY WARRANTIES FOR AVAILABILITY, ACCURACY, TIMELINESS, COMPLETENESS, NON-INFRINGMENT, MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE. Your use of the translations is subject to all use restrictions contained in your Electronic Products License Agreement and by using the translation functionality you agree to forgo any and all claims against ProQuest or its licensors for your use of the translation functionality and any output derived there from. Hide full disclaimer
Details
1 School of Electrical Engineering, University of South China , Hengyang, Hunan 421001 , China