Abstract

Organic field-effect transistors (OFETs) are of interest in unconventional form of electronics. However, high-performance OFETs are currently contact-limited, which represent a major challenge toward operation in the gigahertz regime. Here, we realize ultralow total contact resistance (Rc) down to 14.0 Ω ∙ cm in C10-DNTT OFETs by using transferred platinum (Pt) as contact. We observe evidence of Pt-catalyzed dehydrogenation of side alkyl chains which effectively reduces the metal-semiconductor van der Waals gap and promotes orbital hybridization. We report the ultrahigh performance OFETs, including hole mobility of 18 cm2 V−1 s−1, saturation current of 28.8 μA/μm, subthreshold swing of 60 mV/dec, and intrinsic cutoff frequency of 0.36 GHz. We further develop resist-free transfer and patterning strategies to fabricate large-area OFET arrays, showing 100% yield and excellent variability in the transistor metrics. As alkyl chains widely exist in conjugated molecules and polymers, our strategy can potentially enhance the performance of a broad range of organic optoelectronic devices.

The limitation in metal-semiconductor contact has been a major challenge for high-performance organic field-effect transistors. Here, the authors fabricate the contact by transferring platinum electrode on solution-processed organic films, realizing ultralow total contact resistance down to 14 Ω ∙ cm.

Details

Title
Ultralow contact resistance in organic transistors via orbital hybridization
Author
Zeng, Junpeng 1   VIAFID ORCID Logo  ; He, Daowei 1   VIAFID ORCID Logo  ; Qiao, Jingsi 2   VIAFID ORCID Logo  ; Li, Yating 1 ; Sun, Li 1 ; Li, Weisheng 1 ; Xie, Jiacheng 1 ; Gao, Si 3 ; Pan, Lijia 1   VIAFID ORCID Logo  ; Wang, Peng 3   VIAFID ORCID Logo  ; Xu, Yong 4 ; Li, Yun 1   VIAFID ORCID Logo  ; Qiu, Hao 1 ; Shi, Yi 1   VIAFID ORCID Logo  ; Xu, Jian-Bin 5   VIAFID ORCID Logo  ; Ji, Wei 6   VIAFID ORCID Logo  ; Wang, Xinran 7   VIAFID ORCID Logo 

 Nanjing University, National Laboratory of Solid State Microstructures, School of Electronic Science and Engineering, and Collaborative Innovation Center of Advanced Microstructures, Nanjing, P. R. China (GRID:grid.41156.37) (ISNI:0000 0001 2314 964X) 
 Beijing Institute of Technology, MIIT Key Laboratory for Low-Dimensional Quantum Structure and Devices, School of Integrated Circuits and Electronics, Beijing, China (GRID:grid.43555.32) (ISNI:0000 0000 8841 6246); Renmin University of China, Department of Physics and Beijing Key Laboratory of Optoelectronic Functional Materials & Micro-nano Devices, Beijing, P. R. China (GRID:grid.24539.39) (ISNI:0000 0004 0368 8103) 
 Nanjing University, National Laboratory of Solid State Microstructures, Jiangsu Key Laboratory of Artificial Functional Materials, College of Engineering and Applied Sciences and Collaborative Innovation Center of Advanced Microstructures, Nanjing, P. R. China (GRID:grid.41156.37) (ISNI:0000 0001 2314 964X) 
 Nanjing University of Posts and Telecommunications, College of Electronic and Optical Engineering, Nanjing, P. R. China (GRID:grid.453246.2) (ISNI:0000 0004 0369 3615) 
 The Chinese University of Hong Kong, Department of Electronic Engineering and Materials Science and Technology Research Center, Hong Kong SAR, P. R. China (GRID:grid.10784.3a) (ISNI:0000 0004 1937 0482) 
 Renmin University of China, Department of Physics and Beijing Key Laboratory of Optoelectronic Functional Materials & Micro-nano Devices, Beijing, P. R. China (GRID:grid.24539.39) (ISNI:0000 0004 0368 8103) 
 Nanjing University, National Laboratory of Solid State Microstructures, School of Electronic Science and Engineering, and Collaborative Innovation Center of Advanced Microstructures, Nanjing, P. R. China (GRID:grid.41156.37) (ISNI:0000 0001 2314 964X); Nanjing University, School of Integrated Circuits, Suzhou, P. R. China (GRID:grid.41156.37) (ISNI:0000 0001 2314 964X) 
Pages
324
Publication year
2023
Publication date
2023
Publisher
Nature Publishing Group
e-ISSN
20411723
Source type
Scholarly Journal
Language of publication
English
ProQuest document ID
2766911911
Copyright
© The Author(s) 2023. This work is published under http://creativecommons.org/licenses/by/4.0/ (the “License”). Notwithstanding the ProQuest Terms and Conditions, you may use this content in accordance with the terms of the License.