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Abstract
With the exponential growth of the semiconductor industry, radiation-hardness has become an indispensable property of memory devices. However, implementation of radiation-hardened semiconductor memory devices inevitably requires various radiation-hardening technologies from the layout level to the system level, and such technologies incur a significant energy overhead. Thus, there is a growing demand for emerging memory devices that are energy-efficient and intrinsically radiation-hard. Here, we report a nanoelectromechanical non-volatile memory (NEM-NVM) with an ultra-low energy consumption and radiation-hardness. To achieve an ultra-low operating energy of less than 10
Achieving both low energy consumption and radiation-hardness is highly challenging in memory devices. Here, the authors demonstrate a sub-10 fJ/bit, radiation-hard nanoelectromechanical non-volatile memory through structural and material approaches.
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1 School of Electrical Engineering, Korea Advanced Institute of Science and Technology (KAIST), Daejeon, Republic of Korea (GRID:grid.37172.30) (ISNI:0000 0001 2292 0500)
2 National NanoFab Center (NNFC), Daejeon, Republic of Korea (GRID:grid.496766.c) (ISNI:0000 0004 0546 0225)
3 School of Electrical Engineering, Korea Advanced Institute of Science and Technology (KAIST), Daejeon, Republic of Korea (GRID:grid.37172.30) (ISNI:0000 0001 2292 0500); Taiwan Semiconductor Manufacturing Company (TSMC) Ltd, Phoenix, USA (GRID:grid.37172.30)
4 School of Electrical Engineering, Korea Advanced Institute of Science and Technology (KAIST), Daejeon, Republic of Korea (GRID:grid.37172.30) (ISNI:0000 0001 2292 0500); SAMSUNG ELECTRONICS Co., Ltd, Hwaseong-si, Republic of Korea (GRID:grid.419666.a) (ISNI:0000 0001 1945 5898)