Abstract

With the exponential growth of the semiconductor industry, radiation-hardness has become an indispensable property of memory devices. However, implementation of radiation-hardened semiconductor memory devices inevitably requires various radiation-hardening technologies from the layout level to the system level, and such technologies incur a significant energy overhead. Thus, there is a growing demand for emerging memory devices that are energy-efficient and intrinsically radiation-hard. Here, we report a nanoelectromechanical non-volatile memory (NEM-NVM) with an ultra-low energy consumption and radiation-hardness. To achieve an ultra-low operating energy of less than 10 fJ bit1, we introduce an out-of-plane electrode configuration and electrothermal erase operation. These approaches enable the NEM-NVM to be programmed with an ultra-low energy of 2.83 fJ bit1. Furthermore, due to its mechanically operating mechanisms and radiation-robust structural material, the NEM-NVM retains its superb characteristics without radiation-induced degradation such as increased leakage current, threshold voltage shift, and unintended bit-flip even after 1 Mrad irradiation.

Achieving both low energy consumption and radiation-hardness is highly challenging in memory devices. Here, the authors demonstrate a sub-10 fJ/bit, radiation-hard nanoelectromechanical non-volatile memory through structural and material approaches.

Details

Title
Sub-10 fJ/bit radiation-hard nanoelectromechanical non-volatile memory
Author
Lee, Yong-Bok 1   VIAFID ORCID Logo  ; Kang, Min-Ho 2 ; Choi, Pan-Kyu 3   VIAFID ORCID Logo  ; Kim, Su-Hyun 4 ; Kim, Tae-Soo 1   VIAFID ORCID Logo  ; Lee, So-Young 1 ; Yoon, Jun-Bo 1   VIAFID ORCID Logo 

 School of Electrical Engineering, Korea Advanced Institute of Science and Technology (KAIST), Daejeon, Republic of Korea (GRID:grid.37172.30) (ISNI:0000 0001 2292 0500) 
 National NanoFab Center (NNFC), Daejeon, Republic of Korea (GRID:grid.496766.c) (ISNI:0000 0004 0546 0225) 
 School of Electrical Engineering, Korea Advanced Institute of Science and Technology (KAIST), Daejeon, Republic of Korea (GRID:grid.37172.30) (ISNI:0000 0001 2292 0500); Taiwan Semiconductor Manufacturing Company (TSMC) Ltd, Phoenix, USA (GRID:grid.37172.30) 
 School of Electrical Engineering, Korea Advanced Institute of Science and Technology (KAIST), Daejeon, Republic of Korea (GRID:grid.37172.30) (ISNI:0000 0001 2292 0500); SAMSUNG ELECTRONICS Co., Ltd, Hwaseong-si, Republic of Korea (GRID:grid.419666.a) (ISNI:0000 0001 1945 5898) 
Pages
460
Publication year
2023
Publication date
2023
Publisher
Nature Publishing Group
e-ISSN
20411723
Source type
Scholarly Journal
Language of publication
English
ProQuest document ID
2770372733
Copyright
© The Author(s) 2023. This work is published under http://creativecommons.org/licenses/by/4.0/ (the “License”). Notwithstanding the ProQuest Terms and Conditions, you may use this content in accordance with the terms of the License.