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© 2023 by the authors. Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (https://creativecommons.org/licenses/by/4.0/). Notwithstanding the ProQuest Terms and Conditions, you may use this content in accordance with the terms of the License.

Abstract

We propose a light-field microscopy display system that provides improved image quality and realistic three-dimensional (3D) measurement information. Our approach acquires both high-resolution two-dimensional (2D) and light-field images of the specimen sequentially. We put forward a matting Laplacian-based depth estimation algorithm to obtain nearly realistic 3D surface data, allowing the calculation of depth data, which is relatively close to the actual surface, and measurement information from the light-field images of specimens. High-reliability area data of the focus measure map and spatial affinity information of the matting Laplacian are used to estimate nearly realistic depths. This process represents a reference value for the light-field microscopy depth range that was not previously available. A 3D model is regenerated by combining the depth data and the high-resolution 2D image. The element image array is rendered through a simplified direction-reversal calculation method, which depends on user interaction from the 3D model and is displayed on the 3D display device. We confirm that the proposed system increases the accuracy of depth estimation and measurement and improves the quality of visualization and 3D display images.

Details

Title
High-Quality 3D Visualization System for Light-Field Microscopy with Fine-Scale Shape Measurement through Accurate 3D Surface Data
Author
Kwon, Ki Hoon 1   VIAFID ORCID Logo  ; Erdenebat, Munkh-Uchral 2   VIAFID ORCID Logo  ; Nam, Kim 2   VIAFID ORCID Logo  ; Khuderchuluun, Anar 2 ; Shariar Md Imtiaz 2   VIAFID ORCID Logo  ; Min Young Kim 1   VIAFID ORCID Logo  ; Ki-Chul Kwon 2   VIAFID ORCID Logo 

 School of Electronic and Electrical Engineering, Kyungpook National University, Daegu 41566, Republic of Korea 
 School of Information and Communication Engineering, Chungbuk National University, Cheongju 28644, Republic of Korea 
First page
2173
Publication year
2023
Publication date
2023
Publisher
MDPI AG
e-ISSN
14248220
Source type
Scholarly Journal
Language of publication
English
ProQuest document ID
2779550062
Copyright
© 2023 by the authors. Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (https://creativecommons.org/licenses/by/4.0/). Notwithstanding the ProQuest Terms and Conditions, you may use this content in accordance with the terms of the License.