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© 2023 by the authors. Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (https://creativecommons.org/licenses/by/4.0/). Notwithstanding the ProQuest Terms and Conditions, you may use this content in accordance with the terms of the License.

Abstract

Human–Machine Interface (HMI) plays a key role in the interaction between people and machines, which allows people to easily and intuitively control the machine and immersively experience the virtual world of the meta-universe by virtual reality/augmented reality (VR/AR) technology. Currently, wearable skin-integrated tactile and force sensors are widely used in immersive human–machine interactions due to their ultra-thin, ultra-soft, conformal characteristics. In this paper, the recent progress of tactile and force sensors used in HMI are reviewed, including piezoresistive, capacitive, piezoelectric, triboelectric, and other sensors. Then, this paper discusses how to improve the performance of tactile and force sensors for HMI. Next, this paper summarizes the HMI for dexterous robotic manipulation and VR/AR applications. Finally, this paper summarizes and proposes the future development trend of HMI.

Details

Title
Recent Progress of Tactile and Force Sensors for Human–Machine Interaction
Author
Xu, Jiandong 1   VIAFID ORCID Logo  ; Pan, Jiong 1 ; Cui, Tianrui 1   VIAFID ORCID Logo  ; Zhang, Sheng 2 ; Yang, Yi 1 ; Tian-Ling, Ren 3 

 School of Integrated Circuits and Beijing National Research Center for Information Science and Technology (BNRist), Tsinghua University, Beijing 100084, China 
 Shenzhen International Graduate School, Tsinghua University, Shenzhen 518055, China 
 School of Integrated Circuits and Beijing National Research Center for Information Science and Technology (BNRist), Tsinghua University, Beijing 100084, China; Center for Flexible Electronics Technology, Tsinghua University, Beijing 100084, China 
First page
1868
Publication year
2023
Publication date
2023
Publisher
MDPI AG
e-ISSN
14248220
Source type
Scholarly Journal
Language of publication
English
ProQuest document ID
2779681026
Copyright
© 2023 by the authors. Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (https://creativecommons.org/licenses/by/4.0/). Notwithstanding the ProQuest Terms and Conditions, you may use this content in accordance with the terms of the License.