Abstract

Microelectromechanical system (MEMS) pressure sensors based on silicon are widely used and offer the benefits of miniaturization and high precision. However, they cannot easily withstand high temperatures exceeding 150 °C because of intrinsic material limits. Herein, we proposed and executed a systematic and full-process study of SiC-based MEMS pressure sensors that operate stably from −50 to 300 °C. First, to explore the nonlinear piezoresistive effect, the temperature coefficient of resistance (TCR) values of 4H-SiC piezoresistors were obtained from −50 to 500 °C. A conductivity variation model based on scattering theory was established to reveal the nonlinear variation mechanism. Then, a piezoresistive pressure sensor based on 4H-SiC was designed and fabricated. The sensor shows good output sensitivity (3.38 mV/V/MPa), accuracy (0.56% FS) and low temperature coefficient of sensitivity (TCS) (−0.067% FS/°C) in the range of −50 to 300 °C. In addition, the survivability of the sensor chip in extreme environments was demonstrated by its anti-corrosion capability in H2SO4 and NaOH solutions and its radiation tolerance under 5 W X-rays. Accordingly, the sensor developed in this work has high potential to measure pressure in high-temperature and extreme environments such as are faced in geothermal energy extraction, deep well drilling, aeroengines and gas turbines.

Details

Title
Exploring the nonlinear piezoresistive effect of 4H-SiC and developing MEMS pressure sensors for extreme environments
Author
Wu, Chen 1 ; Fang, Xudong 2   VIAFID ORCID Logo  ; Kang, Qiang 1 ; Fang, Ziyan 1 ; Wu, Junxia 1 ; He, Hongtao 3 ; Zhang, Dong 1 ; Zhao, Libo 2 ; Tian, Bian 2 ; Maeda, Ryutaro 1 ; Jiang, Zhuangde 1 

 Xi’an Jiaotong University, State Key Laboratory for Manufacturing Systems Engineering, International Joint Laboratory for Micro/Nano Manufacturing and Measurement Technologies, Xi’an, China (GRID:grid.43169.39) (ISNI:0000 0001 0599 1243); Xi’an Jiaotong University, School of Mechanical Engineering, Xi’an, China (GRID:grid.43169.39) (ISNI:0000 0001 0599 1243) 
 Xi’an Jiaotong University, State Key Laboratory for Manufacturing Systems Engineering, International Joint Laboratory for Micro/Nano Manufacturing and Measurement Technologies, Xi’an, China (GRID:grid.43169.39) (ISNI:0000 0001 0599 1243); Xi’an Jiaotong University, School of Mechanical Engineering, Xi’an, China (GRID:grid.43169.39) (ISNI:0000 0001 0599 1243); Shandong Laboratory of Yantai Advanced Materials and Green Manufacturing, Yantai, China (GRID:grid.43169.39); Xi’an Jiaotong University, Xi’an Jiaotong University (Yantai) Research Institute for Intelligent Sensing Technology and System, Xi’an, China (GRID:grid.43169.39) (ISNI:0000 0001 0599 1243) 
 HeBei Semiconductor Research Institute, Shijiazhuang, China (GRID:grid.497440.a) (ISNI:0000 0004 1761 5044) 
Pages
41
Publication year
2023
Publication date
2023
Publisher
Springer Nature B.V.
ISSN
20961030
e-ISSN
20557434
Source type
Scholarly Journal
Language of publication
English
ProQuest document ID
2794407585
Copyright
© The Author(s) 2023. This work is published under http://creativecommons.org/licenses/by/4.0/ (the “License”). Notwithstanding the ProQuest Terms and Conditions, you may use this content in accordance with the terms of the License.