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© 2023 by the authors. Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (https://creativecommons.org/licenses/by/4.0/). Notwithstanding the ProQuest Terms and Conditions, you may use this content in accordance with the terms of the License.

Abstract

Electron temperature has attracted great attention in plasma processing, as it dominates the production of chemical species and energetic ions that impact the processing. Despite having been studied for several decades, the mechanism behind the quenching of electron temperature with increasing discharge power has not been fully understood. In this work, we investigated the quenching of electron temperature in an inductively coupled plasma source using Langmuir probe diagnostics, and suggested a quenching mechanism based on the skin effect of electromagnetic waves within local- and non-local kinetic regimes. This finding provides insight into the quenching mechanism and has implications for controlling electron temperature, thereby enabling efficient plasma material processing.

Details

Title
On the Quenching of Electron Temperature in Inductively Coupled Plasma
Author
Seong, Inho 1   VIAFID ORCID Logo  ; Si-jun, Kim 2   VIAFID ORCID Logo  ; Lee, Youngseok 2   VIAFID ORCID Logo  ; Cho, Chulhee 1   VIAFID ORCID Logo  ; Jeong, Wonnyoung 1 ; You, Yebin 1 ; Choi, Minsu 1 ; Choi, Byeongyeop 1 ; You, Shinjae 2   VIAFID ORCID Logo 

 Applied Physics Lab for PLasma Engineering (APPLE), Department of Physics, Chungnam National University, Daejeon 34134, Republic of Korea 
 Applied Physics Lab for PLasma Engineering (APPLE), Department of Physics, Chungnam National University, Daejeon 34134, Republic of Korea; Institute of Quantum Systems (IQS), Chungnam National University, Daejeon 34134, Republic of Korea 
First page
3219
Publication year
2023
Publication date
2023
Publisher
MDPI AG
e-ISSN
19961944
Source type
Scholarly Journal
Language of publication
English
ProQuest document ID
2806578863
Copyright
© 2023 by the authors. Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (https://creativecommons.org/licenses/by/4.0/). Notwithstanding the ProQuest Terms and Conditions, you may use this content in accordance with the terms of the License.