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© 2023 by the authors. Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (https://creativecommons.org/licenses/by/4.0/). Notwithstanding the ProQuest Terms and Conditions, you may use this content in accordance with the terms of the License.

Abstract

Wire arc additive manufacturing (WAAM) is an emerging and promising technology for producing medium-to-large-scale metallic components/structures for different industries, i.e., aerospace, automotive, shipbuilding, etc. It is now a feasible alternative to traditional manufacturing processes due to its shorter lead time, low material waste, and cost-effectiveness. WAAM has been widely used to produce components using different materials, including copper-based alloy wires, in the past decades. This review paper highlights the critical aspects of WAAM process in terms of technology, various challenges faced during WAAM process, different in-process and post-process operations, process monitoring methods, various gases, and different types of materials used in WAAM process. Furthermore, it briefly overviews recent developments in depositing different copper-based alloys via WAAM process.

Details

Title
A Review of the Recent Developments and Challenges in Wire Arc Additive Manufacturing (WAAM) Process
Author
Shah, Abid; Aliyev, Rezo  VIAFID ORCID Logo  ; Zeidler, Henning  VIAFID ORCID Logo  ; Krinke, Stefan
First page
97
Publication year
2023
Publication date
2023
Publisher
MDPI AG
e-ISSN
25044494
Source type
Scholarly Journal
Language of publication
English
ProQuest document ID
2829816113
Copyright
© 2023 by the authors. Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (https://creativecommons.org/licenses/by/4.0/). Notwithstanding the ProQuest Terms and Conditions, you may use this content in accordance with the terms of the License.