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© 2023 by the authors. Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (https://creativecommons.org/licenses/by/4.0/). Notwithstanding the ProQuest Terms and Conditions, you may use this content in accordance with the terms of the License.

Abstract

We have investigated the interface dislocations in InxGa1−xN/GaN heterostructures (0 ≤ x ≤ 0.20) using diffraction contrast analysis in a transmission electron microscope. The results indicate that the structural properties of interface dislocations depend on the indium composition. For lower indium composition (up to x = 0.09), we observed that the screw-type dislocations and dislocation half-loops occurred at the interface, even though the former do not contribute toward elastic relaxation of the misfit strain in the InGaN layer. With the increase in indium composition (0.13 ≤ x ≤ 0.17), in addition to the network of screw-type dislocations, edge-type misfit dislocations were generated, with their density gradually increasing. For higher indium composition (0.18 ≤ x ≤ 0.20), all of the interface dislocations are transformed into a network of straight misfit dislocations along the <10–10> direction, leading to partial relaxation of the InGaN epilayer. The presence of dislocation half-loops may be explained by a slip on basal plane; formation of edge-type misfit dislocations are attributed to punch-out mechanism.

Details

Title
Transition from Screw-Type to Edge-Type Misfit Dislocations at InGaN/GaN Heterointerfaces
Author
Li, Quantong 1 ; Minj, Albert 2   VIAFID ORCID Logo  ; Ling, Yunzhi 3 ; Wang, Changan 4 ; He, Siliang 5 ; Ge, Xiaoming 3 ; He, Chenguang 3   VIAFID ORCID Logo  ; Chan, Guo 3 ; Wang, Jiantai 3 ; Bao, Yuan 3 ; Liu, Zhuming 3 ; Ruterana, Pierre 6 

 Institute of Semiconductors, Guangdong Academy of Sciences, Guangzhou 510650, China; [email protected] (Y.L.); [email protected] (C.W.); [email protected] (X.G.); [email protected] (C.H.); [email protected] (C.G.); [email protected] (J.W.); [email protected] (Y.B.); CIMAP UMR 6252, CNRS ENSICAEN UCBN CEA, 6 Boulevard du Maréchal Juin, 14050 Caen, France; [email protected] 
 Interuniversity Microelectronics Centre (IMEC), Kapeldreef 75, 3000 Leuven, Belgium; [email protected] 
 Institute of Semiconductors, Guangdong Academy of Sciences, Guangzhou 510650, China; [email protected] (Y.L.); [email protected] (C.W.); [email protected] (X.G.); [email protected] (C.H.); [email protected] (C.G.); [email protected] (J.W.); [email protected] (Y.B.) 
 Institute of Semiconductors, Guangdong Academy of Sciences, Guangzhou 510650, China; [email protected] (Y.L.); [email protected] (C.W.); [email protected] (X.G.); [email protected] (C.H.); [email protected] (C.G.); [email protected] (J.W.); [email protected] (Y.B.); School of Electronics & Communication, Guangdong Mechanical and Electrical Polytechnic, Guangzhou 510515, China 
 Key Laboratory of Microelectronic Packaging & Assembly Technology of Guangxi Education Department, School of Mechanical & Electrical Engineering, Guilin University of Electronic Technology, Guilin 541004, China; [email protected] 
 CIMAP UMR 6252, CNRS ENSICAEN UCBN CEA, 6 Boulevard du Maréchal Juin, 14050 Caen, France; [email protected] 
First page
1027
Publication year
2023
Publication date
2023
Publisher
MDPI AG
e-ISSN
20734352
Source type
Scholarly Journal
Language of publication
English
ProQuest document ID
2843052525
Copyright
© 2023 by the authors. Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (https://creativecommons.org/licenses/by/4.0/). Notwithstanding the ProQuest Terms and Conditions, you may use this content in accordance with the terms of the License.