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© 2023 by the authors. Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (https://creativecommons.org/licenses/by/4.0/). Notwithstanding the ProQuest Terms and Conditions, you may use this content in accordance with the terms of the License.

Abstract

We propose a broadband decoupled antenna pair for 5G mobile terminals. The broadband decoupled design of this antenna pair is based on the characteristic mode theory (CMA) and defective ground structure. First, CMA is applied to obtain the characteristic current distribution of the antenna, then the characteristic current sensitive regions are optimized to make the antenna introduce new modes and obtain a wide bandwidth. After that, an antenna pair is added with defective ground structure to obtain a wideband decoupled antenna pair that has small size and high isolation. Next, an eight-element MIMO antenna system is constructed with the obtained broadband decoupled antenna pair, and a composite decoupling technique consisting of defective ground structure (DGS) and decoupling strip is applied to the two antenna pairs on the same side of the bezel to improve the isolation. The simulation and prototype test results show that the eight-element MIMO antenna with −10 dB bandwidth of 3.28~5.85 GHz mainly covers the N77/N78/N79/WLAN 5 GHz band, and the antenna pair are only 1.6 mm apart with good isolation (−16.7 dB), the ECC is less than 0.01, and it has a good total efficiency at the main operating frequency. Finally, the effect of a user’s hand on the antenna is briefly analyzed to verify the robustness of the proposed MIMO antenna system.

Details

Title
Design of Wideband Decoupling Antenna Array for 5G Smartphones at N77/N78/N79/WLAN 5 GHz Bands
Author
Liu, Zhao 1 ; Wang, Yongshun 1 ; Hu, Yao 2 ; Zhang, Lijun 3 

 School of Electronic and Information Engineering, Lanzhou Jiaotong University, Lanzhou 730070, China 
 School of Electronic and Information Engineering, Lanzhou Jiaotong University, Lanzhou 730070, China; School of Mechanical and Electrical Engineering, Lanzhou Jiaotong University, Lanzhou 730070, China 
 School of Electronic and Information Engineering, Lanzhou Jiaotong University, Lanzhou 730070, China; Engineering Research Center of Integrated Circuit Packaging and Testing, The Ministry of National Education, Tianshui 741000, China; School of Electronic Information and Electrical Engineering, Tianshui Normal University, Tianshui 741000, China 
First page
9370
Publication year
2023
Publication date
2023
Publisher
MDPI AG
e-ISSN
20763417
Source type
Scholarly Journal
Language of publication
English
ProQuest document ID
2856798199
Copyright
© 2023 by the authors. Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (https://creativecommons.org/licenses/by/4.0/). Notwithstanding the ProQuest Terms and Conditions, you may use this content in accordance with the terms of the License.