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© 2023 by the authors. Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (https://creativecommons.org/licenses/by/4.0/). Notwithstanding the ProQuest Terms and Conditions, you may use this content in accordance with the terms of the License.

Abstract

Metallic nanowires (NW) usually exhibit unique physical, mechanical, and chemical properties compared to their bulk counterparts. Despite extensive research on their mechanical behavior, the atomic-scale deformation mechanisms of metallic nanowires remain incompletely understood. In this study, we investigate the deformation behavior of Au nanowires embedded with a longitudinal twin boundary (TB) under different loading rates using in situ nanomechanical testing integrated with atomistic simulations. The Au nanowires exhibit a recoverable bending strain of up to 27.5% with the presence of TBs. At low loading rates, the recoverable bending is attributed to the motion of stacking faults (SFs) and their interactions with TBs. At higher loading rates, the formation of high-angle grain boundaries and their reversible migration become dominant in Au nanowires. These findings enhance our understanding of the bending behavior of metallic nanowires, which could inspire the design of nanodevices with improved fatigue resistance and a large recoverable strain capacity.

Details

Title
In Situ Observation of High Bending Strain Recoverability in Au Nanowires
Author
Kong, Lingyi 1   VIAFID ORCID Logo  ; Cao, Guang 1   VIAFID ORCID Logo  ; Zhou, Haofei 2   VIAFID ORCID Logo  ; Wang, Jiangwei 1   VIAFID ORCID Logo 

 Center of Electron Microscopy, State Key Laboratory of Silicon Materials, School of Materials Science and Engineering, Zhejiang University, Hangzhou 310027, China; [email protected] (L.K.); [email protected] (G.C.) 
 Center for X-Mechanics, Department of Engineering Mechanics, Zhejiang University, Hangzhou 310027, China 
First page
1159
Publication year
2023
Publication date
2023
Publisher
MDPI AG
e-ISSN
20734352
Source type
Scholarly Journal
Language of publication
English
ProQuest document ID
2857006967
Copyright
© 2023 by the authors. Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (https://creativecommons.org/licenses/by/4.0/). Notwithstanding the ProQuest Terms and Conditions, you may use this content in accordance with the terms of the License.