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© 2023 by the authors. Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (https://creativecommons.org/licenses/by/4.0/). Notwithstanding the ProQuest Terms and Conditions, you may use this content in accordance with the terms of the License.

Abstract

In the manufacturing industry, inspection systems play a crucial role in ensuring product quality. High-resolution profilometric sensors have become increasingly popular for inspection due to their ability to provide detailed surface information. However, the development and testing of inspection systems can be costly and time-consuming. This paper presents the development of a simulation of an inspection system using a high-resolution profilometric sensor. A geometrical and noise model is proposed to simulate the readings of any actual profilometric sensor. The model replicates the sensor’s movement on the CAD model of the inspected part. The model incorporates the physical properties of the sensor and combines noise sources from sensor uncertainty and speckle noise induced by the roughness of the material. Our contribution lies in noise modeling. This work proposes a combination of Perlin noise to simulate the speckle noise and Gaussian noise for the uncertainty-related noise. Perlin noise is generated based on the surface roughness parameters of the inspected part. The accuracy of the simulation system is evaluated by comparing the simulated scans with real scans. The results highlight the ability to simulate real scans of different parts, using commercial sensor specifications and the CAD model of the inspected part.

Details

Title
Simulation of Laser Profilometer Measurements in the Presence of Speckle Using Perlin Noise
Author
Roos-Hoefgeest, Sara 1   VIAFID ORCID Logo  ; Roos-Hoefgeest, Mario 2   VIAFID ORCID Logo  ; Álvarez, Ignacio 1   VIAFID ORCID Logo  ; González, Rafael C 1   VIAFID ORCID Logo 

 Department of Electrical, Computer Electronics and Systems Engineering, University of Oviedo, 33003 Oviedo, Spain; [email protected] (I.Á.); [email protected] (R.C.G.) 
 Desarrollo de Soluciones Integrales Plus S.L., 33211 Gijón, Spain; [email protected] 
First page
7624
Publication year
2023
Publication date
2023
Publisher
MDPI AG
e-ISSN
14248220
Source type
Scholarly Journal
Language of publication
English
ProQuest document ID
2862730299
Copyright
© 2023 by the authors. Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (https://creativecommons.org/licenses/by/4.0/). Notwithstanding the ProQuest Terms and Conditions, you may use this content in accordance with the terms of the License.