Full text

Turn on search term navigation

© 2023 by the authors. Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (https://creativecommons.org/licenses/by/4.0/). Notwithstanding the ProQuest Terms and Conditions, you may use this content in accordance with the terms of the License.

Abstract

Ladder-like poly(methacryloxypropyl)-silsesquioxanes (LPMASQ) are photocurable Si-based gels characterized by a double-stranded structure that ensures superior thermal stability and mechanical properties than common organic polymers. In this work, these attractive features were exploited to produce, in combination with alumina nanoparticles (NPs), both unmodified and functionalized with methacryloxypropyl-trimethoxysilane (MPTMS), LPMASQ/Al2O3 composites displaying remarkable thermal conductivity. Additionally, we combined LPMASQ with polybutadiene (PB) to produce hybrid nanocomposites with the addition of functionalized Al2O3 NPs. The materials underwent thermal stability, structural, and morphological evaluations via thermogravimetric analysis (TGA), scanning electron microscopy (SEM), energy dispersive X-ray spectroscopy (EDXS), Fourier transform infrared spectroscopy (FTIR), and solid-state nuclear magnetic resonance (NMR). Both blending PB with LPMASQ and surface functionalization of nanoparticles proved to be effective strategies for incorporating a higher ceramic filler amount in the matrices, resulting in significant increases in thermal conductivity. Specifically, a 113.6% increase in comparison to the bare matrix was achieved at relatively low filler content (11.2 vol%) in the presence of 40 wt% LPMASQ. Results highlight the potential of ladder-like silsesquioxanes in the field of thermally conductive polymers and their applications in heat dissipation for flexible electronic devices.

Details

Title
Ladder-like Poly(methacryloxypropyl) silsesquioxane-Al2O3-polybutadiene Flexible Nanocomposites with High Thermal Conductivity
Author
Mingarelli, Pietro 1 ; Romeo, Chiara 1 ; Callone, Emanuela 2   VIAFID ORCID Logo  ; Fredi, Giulia 1   VIAFID ORCID Logo  ; Dorigato, Andrea 1 ; Massimiliano D’Arienzo 3 ; Parrino, Francesco 1   VIAFID ORCID Logo  ; Dirè, Sandra 2   VIAFID ORCID Logo 

 Department of Industrial Engineering, University of Trento, Via Sommarive 9, 38123 Trento, Italy[email protected] (C.R.); [email protected] (E.C.); [email protected] (G.F.); [email protected] (A.D.) 
 Department of Industrial Engineering, University of Trento, Via Sommarive 9, 38123 Trento, Italy[email protected] (C.R.); [email protected] (E.C.); [email protected] (G.F.); [email protected] (A.D.); “Klaus Müller” Magnetic Resonance Laboratory, University of Trento, Via Sommarive 9, 38123 Trento, Italy 
 Department of Materials Science, INSTM, University of Milano-Bicocca, Via R. Cozzi 55, 20125 Milano, Italy; [email protected] 
First page
810
Publication year
2023
Publication date
2023
Publisher
MDPI AG
e-ISSN
23102861
Source type
Scholarly Journal
Language of publication
English
ProQuest document ID
2882423208
Copyright
© 2023 by the authors. Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (https://creativecommons.org/licenses/by/4.0/). Notwithstanding the ProQuest Terms and Conditions, you may use this content in accordance with the terms of the License.