Full text

Turn on search term navigation

© 2023 by the authors. Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (https://creativecommons.org/licenses/by/4.0/). Notwithstanding the ProQuest Terms and Conditions, you may use this content in accordance with the terms of the License.

Abstract

Ceramic waveguide components play a critical role in modern microwave semiconductor systems. For the first time, this work reports experimental results obtained when dielectric ceramics are abrasive-machined into waveguide components. This process will cause subsurface damage (SSD), resulting in a deviation in their working frequency which can degrade the performance of the system. For a substrate-integrated waveguide (SIW) resonator working at 10.1 GHz, SSD with a depth of 89 um can cause a maximum frequency offset of 20.2%. For a mm wave component working at 70 GHz, the corresponding frequency offset could increase to 169%. Three resonator SIW filters with SSD are studied, and the results demonstrate that the frequency offset induced by SSD can reduce the pass rate of the filters from 95.4% to 0%. A theoretical analysis is performed to reveal the mechanism and to offer a quantitative estimation of the limiting range of the offset caused by SSD. Feasible methods for reducing the offset caused by SSD, such as structure design, processing optimization, and material reinforcement, are discussed.

Details

Title
Microwave Frequency Offset Induced by Subsurface Damage in Abrasive-Machined Semiconductor Ceramic Waveguide
Author
Wang, Haoji 1 ; Wei, Jinhua 2 ; Lin, Bin 1   VIAFID ORCID Logo  ; Cui, Xiaoqi 1 ; Hou, Hetian 1 ; Fu, Zhiyuan 3 ; Ding, Jianchun 1 ; Sui, Tianyi 4 

 Key Laboratory for Advanced Ceramics and Machining Technology of Ministry of Education, Tianjin University, Tianjin 300072, China; [email protected] (H.W.); [email protected] (X.C.); [email protected] (H.H.); [email protected] (J.D.) 
 Aerospace Research Institute of Materials and Processing Technology, Beijing 100076, China; [email protected] 
 School of Electronic Information Engineering, Tianjin University, Tianjin 300072, China; [email protected] 
 School of Mechanical Engineering, Tianjin University, Tianjin 300072, China; [email protected] 
First page
1057
Publication year
2023
Publication date
2023
Publisher
MDPI AG
e-ISSN
20751702
Source type
Scholarly Journal
Language of publication
English
ProQuest document ID
2904760260
Copyright
© 2023 by the authors. Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (https://creativecommons.org/licenses/by/4.0/). Notwithstanding the ProQuest Terms and Conditions, you may use this content in accordance with the terms of the License.