Abstract

The mechanisms underlying the influence of the surface chemistry of inorganic materials on polymer structures and fracture behaviours near adhesive interfaces are not fully understood. This study demonstrates the first clear and direct evidence that molecular surface segregation and cross-linking of epoxy resin are driven by intermolecular forces at the inorganic surfaces alone, which can be linked directly to adhesive failure mechanisms. We prepare adhesive interfaces between epoxy resin and silicon substrates with varying surface chemistries (OH and H terminations) with a smoothness below 1 nm, which have different adhesive strengths by ~13 %. The epoxy resins within sub-nanometre distance from the surfaces with different chemistries exhibit distinct amine-to-epoxy ratios, cross-linked network structures, and adhesion energies. The OH- and H-terminated interfaces exhibit cohesive failure and interfacial delamination, respectively. The substrate surface chemistry impacts the cross-linked structures of the epoxy resins within several nanometres of the interfaces and the adsorption structures of molecules at the interfaces, which result in different fracture behaviours and adhesive strengths.

The mechanisms of adhesion between polymers and inorganic materials are not fully understood. Here, authors demonstrate the clear evidence that the surface chemistry impacts the crosslinked structures of resins near the interfaces, resulting in different fracture behaviours and adhesive strengths.

Details

Title
Effect of inorganic material surface chemistry on structures and fracture behaviours of epoxy resin
Author
Miyata, Tomohiro 1   VIAFID ORCID Logo  ; Sato, Yohei K. 1 ; Kawagoe, Yoshiaki 2   VIAFID ORCID Logo  ; Shirasu, Keiichi 3   VIAFID ORCID Logo  ; Wang, Hsiao-Fang 4   VIAFID ORCID Logo  ; Kumagai, Akemi 1 ; Kinoshita, Sora 5 ; Mizukami, Masashi 6   VIAFID ORCID Logo  ; Yoshida, Kaname 7   VIAFID ORCID Logo  ; Huang, Hsin-Hui 7 ; Okabe, Tomonaga 8   VIAFID ORCID Logo  ; Hagita, Katsumi 9   VIAFID ORCID Logo  ; Mizoguchi, Teruyasu 10   VIAFID ORCID Logo  ; Jinnai, Hiroshi 1   VIAFID ORCID Logo 

 Tohoku University, Institute of Multidisciplinary Research for Advanced Materials, Sendai, Japan (GRID:grid.69566.3a) (ISNI:0000 0001 2248 6943) 
 Tohoku University, Department of Aerospace Engineering, Graduate School of Engineering, Sendai, Japan (GRID:grid.69566.3a) (ISNI:0000 0001 2248 6943) 
 Tohoku University, Department of Finemechanics, Graduate School of Engineering, Sendai, Japan (GRID:grid.69566.3a) (ISNI:0000 0001 2248 6943) 
 National Central University, Department of Chemical and Materials Engineering, Taoyuan City, Taiwan (GRID:grid.37589.30) (ISNI:0000 0004 0532 3167) 
 Tohoku University, Department of Applied Chemistry, Graduate School of Engineering, Sendai, Japan (GRID:grid.69566.3a) (ISNI:0000 0001 2248 6943) 
 Tohoku University, New Industry Creation Hatchery Center, Sendai, Japan (GRID:grid.69566.3a) (ISNI:0000 0001 2248 6943) 
 Nanostructures Research Laboratory, Japan Fine Ceramics Center, Nagoya, Japan (GRID:grid.410791.a) (ISNI:0000 0001 1370 1197) 
 Tohoku University, Department of Aerospace Engineering, Graduate School of Engineering, Sendai, Japan (GRID:grid.69566.3a) (ISNI:0000 0001 2248 6943); National Institute for Materials Science, Research Center for Structural Materials, Polymer Matrix Hybrid Composite Materials Group, Tsukuba, Ibaraki, Japan (GRID:grid.21941.3f) (ISNI:0000 0001 0789 6880); University of Washington, Department of Materials Science and Engineering, Seattle, WA, USA (GRID:grid.34477.33) (ISNI:0000 0001 2298 6657) 
 National Defense Academy, Department of Applied Physics, Yokosuka, Japan (GRID:grid.260563.4) (ISNI:0000 0004 0376 0080) 
10  The University of Tokyo, Institute of Industrial Science, Meguro-ku, Japan (GRID:grid.26999.3d) (ISNI:0000 0001 2151 536X) 
Pages
1898
Publication year
2024
Publication date
2024
Publisher
Nature Publishing Group
e-ISSN
20411723
Source type
Scholarly Journal
Language of publication
English
ProQuest document ID
2952444425
Copyright
© The Author(s) 2024. This work is published under http://creativecommons.org/licenses/by/4.0/ (the “License”). Notwithstanding the ProQuest Terms and Conditions, you may use this content in accordance with the terms of the License.