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© 2024 by the authors. Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (https://creativecommons.org/licenses/by/4.0/). Notwithstanding the ProQuest Terms and Conditions, you may use this content in accordance with the terms of the License.

Abstract

Periodically poled lithium niobate on insulator (PPLNOI) offers an admirably promising platform for the advancement of nonlinear photonic integrated circuits (PICs). In this context, domain inversion engineering emerges as a key process to achieve efficient nonlinear conversion. However, periodic poling processing of thin-film lithium niobate has only been realized on the chip level, which significantly limits its applications in large-scale nonlinear photonic systems that necessitate the integration of multiple nonlinear components on a single chip with uniform performances. Here, we demonstrate a wafer-scale periodic poling technique on a 4-inch LNOI wafer with high fidelity. The reversal lengths span from 0.5 to 10.17 mm, encompassing an area of ~1 cm2 with periods ranging from 4.38 to 5.51 μm. Efficient poling was achieved with a single manipulation, benefiting from the targeted grouped electrode pads and adaptable comb line widths in our experiment. As a result, domain inversion is ultimately implemented across the entire wafer with a 100% success rate and 98% high-quality rate on average, showcasing high throughput and stability, which is fundamentally scalable and highly cost-effective in contrast to traditional size-restricted chiplet-level poling. Our study holds significant promise to dramatically promote ultra-high performance to a broad spectrum of applications, including optical communications, photonic neural networks, and quantum photonics.

Details

Title
Wafer-Scale Periodic Poling of Thin-Film Lithium Niobate
Author
Chen, Mengwen 1   VIAFID ORCID Logo  ; Wang, Chenyu 1   VIAFID ORCID Logo  ; Xiao-Hui, Tian 1   VIAFID ORCID Logo  ; Tang, Jie 2 ; Gu, Xiaowen 2 ; Qian, Guang 2 ; Jia, Kunpeng 1 ; Hua-Ying, Liu 1   VIAFID ORCID Logo  ; Zhong, Yan 3   VIAFID ORCID Logo  ; Ye, Zhilin 4 ; Yin, Zhijun 4 ; Shi-Ning, Zhu 1 ; Xie, Zhenda 1 

 National Laboratory of Solid State Microstructures, School of Electronic Science and Engineering, School of Physics, College of Engineering and Applied Sciences, Collaborative Innovation Center of Advanced Microstructures, Nanjing University, Nanjing 210093, China; [email protected] (M.C.); [email protected] (C.W.); [email protected] (K.J.); [email protected] (H.-Y.L.); [email protected] (S.-N.Z.) 
 National Key Laboratory of Solid-State Microwave Devices and Circuits, Nanjing Electronic Devices Institute, Nanjing 210016, China; [email protected] (J.T.); [email protected] (X.G.); [email protected] (G.Q.) 
 School of Integrated Circuits, Nanjing University of Information Science and Technology, Nanjing 210044, China; [email protected]; NanZhi Institute of Advanced Optoelectronic Integration Technology Co., Ltd., Nanjing 210018, China; [email protected] (Z.Y.); 
 NanZhi Institute of Advanced Optoelectronic Integration Technology Co., Ltd., Nanjing 210018, China; [email protected] (Z.Y.); 
First page
1720
Publication year
2024
Publication date
2024
Publisher
MDPI AG
e-ISSN
19961944
Source type
Scholarly Journal
Language of publication
English
ProQuest document ID
3047005222
Copyright
© 2024 by the authors. Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (https://creativecommons.org/licenses/by/4.0/). Notwithstanding the ProQuest Terms and Conditions, you may use this content in accordance with the terms of the License.