Abstract

A typical mid-to low-rise building is subject to strong dynamic interaction effects due to its relative degree of flexibility with the soil. Thus, it is necessary to take this effect into account when evaluating the seismic performance of such buildings. In this paper, we apply the modal iterative error correction method (MIEC method) to the foreshock records of the 2011 Tohoku earthquake to identify the coupled superstructure–foundation–soil system in a real building with few observation points. For this, observations made on the first, second, fifth, and eighth floors of an eight-story steel-reinforced concrete were used for identification of building parameters. In this earthquake, the response of each part of the building is within a linear range. First, the stiffness of the superstructure is identified as a parameter in the fixed-foundation model. Next, this stiffness value is used to create a Sway-Rocking model, and the identification was performed using soil spring as a parameter. The identification results for a real building with limited number of observation points, including soil springs in a linear range, showed good correspondence with the observed values.

Details

Title
Identification of Building Parameters Considering Soil-Structure Interaction Based on Observed Earthquake Records
Author
Kitaoka, Hinata 1 ; Nakamura, Naohiro 1 ; Nabeshima, Kunihiko 2 

 Hiroshima University , 1-4-1, Kagamiyama, Higashihiroshima-city, Hiroshima, Japan, 739-8527 
 Kobe University , 1-1, Rokkodai-cho, Nada-ku, Kobe-city, Hyogo, Japan, 657-8501 
First page
082010
Publication year
2024
Publication date
Jun 2024
Publisher
IOP Publishing
ISSN
17426588
e-ISSN
17426596
Source type
Scholarly Journal
Language of publication
English
ProQuest document ID
3081571406
Copyright
Published under licence by IOP Publishing Ltd. This work is published under https://creativecommons.org/licenses/by/4.0/ (the “License”). Notwithstanding the ProQuest Terms and Conditions, you may use this content in accordance with the terms of the License.