Introduction
Photovoltaics (PV) represents nowadays the largest share of newly installed power capacity for electricity production, including both renewable and conventional sources.[1] However, current capacity figures still lag well behind those needed to meet the targets set on net-zero emissions, as stated in the Paris agreement and recently updated in COP26.[2] Within this scenario, any advancement towards an improvement in silicon-based PV efficiency/cost ratios will be valuable for furthering the PV deployment in the market over the next decades. While high-purity (in the range of 9–11 N) crystalline polysilicon (poly-Si) is a very robust and efficient material that dominates the PV market, still a significant ≈12% fraction of the silicon-based PV-module cost and about ≈20% of its energy investment is linked alone with silicon purification.[3] As a matter of fact, such a high degree of purity is mostly required for fulfilling the demands of the electronic sector, where a single impurity present in a nano-device contained within a computer chip can compromise its whole functionality. In this respect, finding environmentally friendly, cheaper, and less energy-demanding alternatives to high-purity Si for PV, while still meeting electronic quality indicators compatible with high-efficiency device manufacturing (what has been termed as solar-grade silicon), represents a neat avenue for furthering PV deployment.
Upgraded metallurgical grade silicon (UMG-Si) is obtained from the metallurgical route and results in lower economic costs and environmental impact as compared to conventional poly-Si.[4–6] However, this lower cost is typically achieved at the expense of incorporating a higher concentration of impurities during crystallisation.[4] This aspect can be detrimental to the performance of related PV devices, particularly affecting charge carrier lifetimes and charge carrier mobilities. To overcome these drawbacks, different low-energy input treatments have been studied with the aim of improving the electronic quality of low-cost UMG-Si-wafers with high impurity contents. Among them, phosphorous diffusion gettering (PDG), an industrial compatible process commonly used during emitter formation in standard solar cell technology, has proved effective in improving the performance of UMG-Si.[7–11] The PDG process is used for driving diluted impurities, particularly transition metals, towards the wafer surface, where they can be effectively removed following an etching process. As a result, PDG-treated UMG-Si wafers have shown improved charge carrier lifetimes when compared with reference samples;[10,12,13] however, little is known yet about the impact of specific PDG treatments on UMG-Si-related charge carrier mobilities. Disentangling mobility-lifetime products is often not straightforward and requires either the application of suitable models through iterative calculations to the experimental results,[14] or alternatively the utilization of specialized characterization tools capable of discerning between both parameters.
In this work, we have employed time-resolved Terahertz spectroscopy (TRTS), in combination with inductively coupled quasi-steady-state photoconductance decay (QSS-PCD), to study the impact of PDG processes in both critical parameters: the charge carrier lifetime and the charge carrier mobility of UMG-Si wafers, resolving both parameters independently. As a result of the PDG treatment, we find that effective carrier lifetimes in UMG-Si are boosted from ≈50 ps up to ≈25 μs. By means of TRTS, we could also retrieve the complex frequency-resolved conductivity in the THz region, from which we can infer a notable improvement in the charge carrier mobility figures of UMG-Si treated samples, changing from 283 ± 37 up to 726 ± 23 cm2 Vs−1 upon the PDG treatment. Most remarkably, the recorded mobility values of PDG-treated UMG-Si wafers parallel those observed in commercially available high-purity poly-Si float zone reference wafers. These results validate PDG processing as a meaningful treatment for upgrading the electronic quality of UMG-Si wafers to levels commensurate with poly-Si wafers produced by the Siemens process.
Results and Discussion
Multi-crystalline wafers consisting of p-type UMG-Si analyzed herein were manufactured via the metallurgical route by FerroGlobe and crystallized as multi-crystalline ingots by FerroSolar.[5,6] UMG-ingots were sliced in 15.6 × 15.6 cm2, 200 μm thick wafers, with resistivity values in the range of 1–1.7 Ω cm. The original, as-received wafers were subsequently cut into nine 5 × 5 cm2 wafers for these studies (see Figure 1a). The material is moderately compensated due to the presence of P and B dopants introduced during the crystallization stage, with a compensation level defined as (ND + NA)/(NA-ND) ranging between 2 and 4 (NA and ND referring to the concentration of acceptors and donors respectively). After chemical cleaning of the UMG-Si as-received samples (see methods), PDG treatments were conducted on UMG-Si wafers in a tubular furnace, using liquid POCl3 as P-source, at 800 °C for 1 h, letting the samples cool down passively outside the furnace. The near-surface region, including the resulting P-doped emitter, was subsequently chemically etched (see methods), recovering thereby a p-type wafer with upgraded electronic quality, as a result of the gettering action associated with P-diffusion. To interrogate carrier lifetimes and to prevent surface recombination effects, the PDG-treated samples were provided with a thin SiNx passivation coating (see Figure 1b), deposited by plasma-enhanced chemical vapor deposition (PECVD). Although not optimized here for PV applications, this industrially compatible SiNx treatment is typically employed also as an anti-reflection coating, due to a proper refractive index matching between air and the silicon substrate underneath (see Figure 1c). From now on, we will refer to wafers provided with both, the PDG treatment and the SiNx coating as “UMG-Si treated” samples. Analogously, “UMG-Si untreated” samples will refer to the bare wafers.
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To study charge carrier lifetimes of UMG-Si samples, we have combined two powerful contactless techniques, namely inductively coupled photoconductance decay (PCD)[15–18] and time-resolved THz spectroscopy (TRTS),[19–21] which together span the accessible range of carrier lifetime values from pico- up to milli-seconds. Figure 2a represents TRTS data showing the normalized time-resolved response as a function of pump-probe delay of the real conductivity for treated and untreated UMG-Si samples (green and black dotted traces, respectively). Signal normalization in Figure 2a is justified here as the employed fluences provide first-order dynamics (see Figure S1 and S2, Supporting Information). The samples were excited with a 387.5 nm laser pump beam (2.6 μJ cm−2 with 150 fs pulse width) and probed with a ≈3 mm diameter and ≈1 THz bandwidth probe impinging on single grains of the multi-crystalline UMG-Si wafers (see Figure 1a,b). Within the same wafer, grain-to-grain TRTS responses were practically identical, with just minor changes in amplitude that we attribute to reflectivity differences among randomly oriented grains (see Figure S4, Supporting Information).
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As it is evident from Figure 2a, the PDG treatment on UMG-Si wafers has a significant impact on charge carrier lifetimes as monitored by TRTS over the probed 1 ns time window. Right after above-bandgap pump excitation (at 0 ps pump-probe delay), a rise in the real conductivity is resolved by TRTS, which represents the instantaneous generation of free carriers in the sample ( ; where e is the electron charge, N(t) the photoinduced carrier density as a function of time and μ the charge carrier mobility). For the untreated UMG samples, the initial TRTS rise is followed by a decay over the probed window. The decay can be well fitted by a phenomenological bi-phasic exponential function ), providing rate constants k1 and k2 of 1.9 × 109 ± 1.92 × 108 and 1.75 × 1010 ± 2.6 × 109 s−1, respectively. From the rate constants we can estimate charge carrier decay times of τ1 = 524 ± 53 and τ2 = 57 ± 8 ps (where τi = 1/ki; i = 1,2). For the case of the treated UMG-Si wafer (green trace in Figure 2a), a clear improvement in charge carrier lifetime is resolved; however, it cannot be quantified by TRTS within the recorded time window (τ >> 1 ns).
To quantify the carrier lifetime improvement of the UMG-Si-treated wafer, the same samples were characterized by PCD in quasi-steady-state (QSS) mode, thereby spanning the observed lifetime window up to the ms scale (Figure 2b). In QSS-PCD measurements, the photoconductance of the sample is recorded as a photovoltage developed in an inductively coupled coil while a slowly varying illumination impinges upon the sample. If the characteristic time of the flashlight source (typically 10 ms) is much longer than the carrier lifetime in the sample, QSS conditions can be invoked to solve the continuity equation
Having demonstrated a substantial boost in charge carrier lifetimes upon PDG treatment, we focus our attention now on its impact on the charge carrier mobility. For this purpose, we have analyzed the frequency-resolved complex conductivity σ(ω) that can be retrieved from TRTS data at any pump-probe delay. Figure 3 shows the real (black solid dots) and imaginary (open blue circles) components of σ(ω) obtained for the untreated and treated samples, panels a and b, respectively. The data have been obtained at a pump-probe delay of 3 ps, thereby ensuring the complete cooling of hot charge carriers generated after ≈400 nm excitation.[24,25] The first panel (Figure 3a), representing σ(ω) for untreated UMG-Si, shows a characteristic negative imaginary conductivity component that increases with frequency and changes sign to positive values within the probed THz window, while the real part of the conductivity remains always positive. This line shape can be well described by the Drude–Smith (DS) model, a phenomenological extension of the free carrier Drude model, where long-range transport in the DC limit is limited by charge carrier localization.[26] The DS model can be defined as where represents the Drude conductivity
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Figure 3b shows the frequency-resolved conductivity of the treated UMG-Si sample. The plot reveals a decreasing real and increasing imaginary conductivity components (both positive) in the analyzed THz range. In this case, we can reproduce the data very well invoking the simple Drude model for free carriers (see Equation (2)). From the best fit (solid lines in Figure 3b), we obtain a value for the scattering time and plasma frequency of 107 ± 5 fs and 54 ± 1 THz, respectively. Considering once more the value for the electron effective mass for conductivity, the corresponding mobility is 726 ± 23 cm2 V−1 s−1, for a pump-induced carrier density of 2.34 × 1017 ± 4 × 1016 cm−3. This figure shows an almost threefold improvement in charge carrier mobility for the PDG-treated UMG-Si samples. To place this figure in context, we measured by TRTS under the same experimental conditions a highly pure float zone (FZ) monocrystalline Si wafer (see Figure S7, Supporting Information). As summarized in Table 1, and remarkably, the charge carrier mobility obtained for PDG-treated UMG-Si samples parallels, within the experimental error, the value obtained from the FZ-Si reference. By analyzing a sample without the SiN treatment under the same excitation conditions, we conclude that the PDG process is the main contributor to the observed increase in charge carrier mobility (see Figure S6, Supporting Information). This result demonstrates that the charge carrier mobility of UMG-Si after the employed PDG treatment is at the same level as state-of-the-art conventional poly-Si wafers.
Table 1 Summary of results obtained from OPTP from UMG-Si wafers and FZ-Si crystalline silicon reference wafer
Sample | Charge carrier density [cm−3] | Mobility [cm2 V−1 s−1] |
UMG-Si untreated | 8.9 × 1017 ± 3.6·1016 | 283 ± 37 |
UMG-Si treated | 2.34 × 1017 ± 4·1016 | 726 ± 23 |
FZ-Si | 5.6 × 1017 ± 1.4·1016 | 718 ± 19 |
Conclusion
In summary, we have demonstrated an important improvement of the carrier mobility in UMG-Si wafers as a result of a gettering process. Phosphorous diffusion can effectively upgrade the carrier lifetime and mobility, leading to improvements as large as about four orders of magnitude in the case of the lifetime, and pushing the charge carrier mobility up to 726 cm2 V−1 s−1, at the same level of semi-insulating, single crystalline, commercially available polysilicon. The improvement observed in the carrier lifetimes after PDG treatment is associated with the removal of bulk impurities; correlated to this effect, the improvement in charge carrier mobility could be attributed to a reduction of the impurity scattering in the samples.[28,29] Sample to sample variability in both lifetimes and mobilities could be a priori expected on wafers coming from different UMG ingots and different heights within an ingot, if so, the effectiveness in absolute terms of the proposed PDG process will depend on the specific nature and concentration of the limiting impurity. In any case, our results demonstrate the effectiveness of simple pre-conditioning steps adapted for UMG-Si, which are compatible with current solar cell technology manufacturing. The lower economic and environmental impact of UMG-Si in comparison to conventional polysilicon can thus be fully exploited from a material no longer penalized by its starting electronic quality. Further work is nevertheless needed regarding the optimization of the gettering and passivating processes, accounting for, e.g., sample and grain-to-grain heterogeneity and the impact of dislocations and grain boundaries on the expected performance of UMG-Si-based devices.
Experimental Section
Materials
Solar-grade silicon wafers have been provided by Aurinka PV. Samples were manufactured via the metallurgical route by FerroGlobe[5] and then crystallized as multi-crystalline ingots by FerroSolar. UMG-ingots were sliced in 15.6 × 15.6 cm2, 200 μm thick wafers, with resistivity values in the range 1–1.7 Ω cm, as measured by the four-point probe method. The original wafers were subsequently cut into nine 5 × 5 cm2 wafers for these studies. The material is moderately compensated due to the presence of P and B dopants introduced during the crystallization stage, with a compensation level defined as (ND + NA)/(NA − ND) ranging between 2 and 4. All wafers were chemically etched with CP4 (H2O/HNO3/HF: 450/150/30) and RCA1 (H2O/H2O2/NH3: 500/100/100) before the PDG.
Semi-insulating silicon crystalline wafer (float-zone) used as a reference was obtained from Sigma-Aldrich with ID: 646687.
PDG-Treatment UMG-Si Wafers
PDG processes were performed in a tubular furnace under O2 and N2 atmosphere. Liquid POCl3 was the P source in a process carried out at 800 °C. After PDG, the near-surface region, including the n-type emitter formed after P-diffusion, was removed by chemical etching with CP4 (HNO3/HF) and RCA1 (H2O2/HF) surface cleaning. SiNx passivation coating was deposited via a low-temperature Plasma enhanced chemical vapor deposition (PECVD) process in a Meyer Burger AK-400 reactor.
TRTS
The ultrafast photo-conductivity response was determined using TRTS. The setup used is similar to the one described in ref. [19]. A Ti:sapphire laser amplifier system generation provided <150 fs laser pulses centered at 775 nm at a repetition rate of 1 kHz. The laser output was used for the optical pump by doubling its frequency with a beta barium borate (BBO) crystal, obtaining a pump wavelength of 387.5 nm. For the optical generation, THz light was generated via optical rectification on a 1 mm slab of ZnTe crystal cut along the (110) plane. The detection was performed via electro-optical sampling on an identical ZnTe crystal. THz signal gives access to monitor the change in the photoconductivity according to: , where N is the charge carrier density and is the mobility, dependent on the carrier scattering time, τ, and on the effective mass, . The optical penetration depth is estimated in 80 nm,[30] which sets the volume of charge carrier photogeneration. Since the penetration depth, , is small compared to the THz wavelength and the sample thickness, the system can be considered as a photoexcited thin film. The frequency-dependent complex conductivity σ(ω) can be obtained from the expression below,[19] measuring in the time domain the electric field of the THz pulses transmitted through the non-excited sample and the pump-induced change [19]
Minority Carrier Lifetime
QSS-PCD measurements were obtained using the Sinton Instruments WCT-120 tool, using a slow flash decay mode with a characteristic constant decay of 1.8 ms, as measured at the reference cell. For the acquisition of the lifetime curves, an optical constant of 0.7 accounted for reflectivity losses and the Dannhäuser carrier mobility model was used to translate PC versus time curves into τ vs Δn traces.
Reflectance
Global reflectance was measured with the Shimadzu spectrophotometer UV-2401 PC using the integrating sphere ISR-240 A and with a white plate of BaSO4 as reference.
Acknowledgements
The authors acknowledge financial support from Comunidad de Madrid (2017-T1/AMB-5207, 2021-5A/AMB-20942, and Y2018/NMT-5028), from the Spanish Government (PID2019-107808RA-I00), and from the Max Planck society. MCIN/AEI/ 10.13039/501100011033 is also acknowledged for financial support through the GREASE project (PID2020-113533RB-C31) and the project MADRID-PV2 (S2018/EMT-4308) funded by the Regional Government of Madrid with the support from FEDER Funds. The authors would like to also acknowledge Javier Álvarez Conde and Dr. Eva María Garcia-Frutos (ICMM-CSIC) for letting us use the UV-2401 equipment.
Conflict of Interest
The authors declare no conflict of interest.
Data Availability Statement
The data that support the findings of this study are available from the corresponding author upon reasonable request.
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Copyright John Wiley & Sons, Inc. 2022
Abstract
Herein, it is demonstrated how the carrier mobility and carrier lifetime of upgraded‐metallurgical grade silicon (UMG‐Si), a feedstock alternative to electronic‐grade, high‐purity polysilicon dominating photovoltaic technology, can be largely improved upon the gettering action of industrially compatible phosphorous diffusion gettering (PDG) process at the wafer level. The results, based on ultrafast THz spectroscopy and inductively coupled photoconductive decay measurements, show outstanding increments in the carrier lifetime of PDG‐treated multi‐crystalline UMG‐Si wafers from 50 ps to 25 μs and a boost in intra‐grain charge carrier mobility from 283 ± 37 up to 726 ± 23 cm2 Vs−1. Most remarkably, the latter figure parallels the carrier mobility observed in monocrystalline wafers manufactured from polysilicon, thereby demonstrating the effectiveness of a simple pre‐conditioning step in upgrading the electronic properties of UMG‐Si up to the device level.
You have requested "on-the-fly" machine translation of selected content from our databases. This functionality is provided solely for your convenience and is in no way intended to replace human translation. Show full disclaimer
Neither ProQuest nor its licensors make any representations or warranties with respect to the translations. The translations are automatically generated "AS IS" and "AS AVAILABLE" and are not retained in our systems. PROQUEST AND ITS LICENSORS SPECIFICALLY DISCLAIM ANY AND ALL EXPRESS OR IMPLIED WARRANTIES, INCLUDING WITHOUT LIMITATION, ANY WARRANTIES FOR AVAILABILITY, ACCURACY, TIMELINESS, COMPLETENESS, NON-INFRINGMENT, MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE. Your use of the translations is subject to all use restrictions contained in your Electronic Products License Agreement and by using the translation functionality you agree to forgo any and all claims against ProQuest or its licensors for your use of the translation functionality and any output derived there from. Hide full disclaimer