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© 2024. This work is published under http://creativecommons.org/licenses/by/4.0/ (the "License"). Notwithstanding the ProQuest Terms and Conditions, you may use this content in accordance with the terms of the License.

Abstract

Although quasi‐2D Ruddlesden‒Popper (RP) perovskite exhibits advantages in stability, their photovoltaic performance are still inferior to 3D counterparts. Optimizing the buried interface of RP perovskite and suppress energetic losses can be a promising approach for enhancing efficiency and stability of inverted quasi‐2D RP perovskite solar cells (PSCs). Among which, constructing polymer hole‐transporting materials (HTMs) with defect passivation functions is of great significance for buried‐interface engineering of inverted quasi‐2D RP PSCs. Herein, by employing side‐chain tailoring strategy to extend the π‐conjugation and regulate functionality of side‐chain groups, target polymer HTMs (PVCz‐ThSMeTPA and PVCz‐ThOMeTPA) with high mobility and multisite passivation functions are achieved. The presence of more sulfur atom‐containing groups in side‐chain endows PVCz‐ThSMeTPA with increased intra/intermolecular interaction, appropriate energy level, and enhanced buried interfacial interactions with quasi‐2D RP perovskite. The hole mobility of PVCz‐ThSMeTPA is up to 9.20 × 10−4 cm2 V−1 S−1. Furthermore, PVCz‐ThSMeTPA as multifunctional polymer HTM with multiple chemical anchor sites for buried‐interface engineering of quasi‐2D PSCs can enable effective charge extraction, defects passivation, and perovskite crystallization modulation. Eventually, the PVCz‐ThSMeTPA‐based inverted quasi‐2D PSC achieves a champion power conversion efficiency of 22.37%, which represents one of the highest power conversion efficiencies reported to date for quasi‐2D RP PSCs.

Details

Title
Tailored Polymer Hole‐Transporting Materials with Multisite Passivation Functions for Effective Buried‐Interface Engineering of Inverted Quasi‐2D Perovskite Solar Cells
Author
Zhao, Xiujie 1 ; Bao, Yinyu 1 ; Pan, Zhengwu 1 ; Su, Qianyu 1 ; Peng, Darui 1 ; Gao, Deqing 1 ; Yin, Chengrong 1   VIAFID ORCID Logo  ; Wang, Jianpu 1 ; Huang, Wei 2 

 Key Laboratory of Flexible Electronics (KLOFE) & Institute of Advanced Materials (IAM), Jiangsu National Synergistic Innovation Center for Advanced Materials (SICAM), Nanjing Tech University (NanjingTech), Nanjing, P. R. China 
 Key Laboratory of Flexible Electronics (KLOFE) & Institute of Advanced Materials (IAM), Jiangsu National Synergistic Innovation Center for Advanced Materials (SICAM), Nanjing Tech University (NanjingTech), Nanjing, P. R. China, Key Laboratory for Organic Electronics and Information Displays & Institute of Advanced Materials (IAM), Nanjing University of Posts & Telecommunications, Nanjing, Jiangsu, P. R. China 
Section
Research Article
Publication year
2024
Publication date
Dec 1, 2024
Publisher
John Wiley & Sons, Inc.
e-ISSN
21983844
Source type
Scholarly Journal
Language of publication
English
ProQuest document ID
3142928101
Copyright
© 2024. This work is published under http://creativecommons.org/licenses/by/4.0/ (the "License"). Notwithstanding the ProQuest Terms and Conditions, you may use this content in accordance with the terms of the License.