Abstract
Highlights
A comprehensive review focused on the recent advancement of the advanced and artificial intelligence (AI) chip is presented.
The design tactics for the enhanced and AI chips can be conducted from a diversity of aspects, with materials, circuit, architecture, and packaging technique taken into considerations, for the pursuit of multimodal data processing abilities, robust reconfigurability, high energy efficiency, and enhanced computing power.
A broad outlook on the future considerations of the advanced chip is put forward.
Recent years have witnessed transformative changes brought about by artificial intelligence (AI) techniques with billions of parameters for the realization of high accuracy, proposing high demand for the advanced and AI chip to solve these AI tasks efficiently and powerfully. Rapid progress has been made in the field of advanced chips recently, such as the development of photonic computing, the advancement of the quantum processors, the boost of the biomimetic chips, and so on. Designs tactics of the advanced chips can be conducted with elaborated consideration of materials, algorithms, models, architectures, and so on. Though a few reviews present the development of the chips from their unique aspects, reviews in the view of the latest design for advanced and AI chips are few. Here, the newest development is systematically reviewed in the field of advanced chips. First, background and mechanisms are summarized, and subsequently most important considerations for co-design of the software and hardware are illustrated. Next, strategies are summed up to obtain advanced and AI chips with high excellent performance by taking the important information processing steps into consideration, after which the design thought for the advanced chips in the future is proposed. Finally, some perspectives are put forward.
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1 School of Fashion and Textiles, The Hong Kong Polytechnic University, Nanotechnology Center, Hong Kong, People’s Republic of China (GRID:grid.16890.36) (ISNI:0000 0004 1764 6123); The Education University of Hong Kong, Department of Mathematics and Information Technology, Hong Kong, People’s Republic of China (GRID:grid.419993.f) (ISNI:0000 0004 1799 6254)
2 Central South University, State Key Laboratory for Powder Metallurgy, Changsha, People’s Republic of China (GRID:grid.216417.7) (ISNI:0000 0001 0379 7164)
3 Ningbo Institute of Materials Technology and Engineering, Chinese Academy of Sciences, Ningbo, People’s Republic of China (GRID:grid.458492.6) (ISNI:0000 0004 0644 7516)
4 The Education University of Hong Kong, Department of Mathematics and Information Technology, Hong Kong, People’s Republic of China (GRID:grid.419993.f) (ISNI:0000 0004 1799 6254)
5 School of Fashion and Textiles, The Hong Kong Polytechnic University, Nanotechnology Center, Hong Kong, People’s Republic of China (GRID:grid.16890.36) (ISNI:0000 0004 1764 6123)