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© 2025 by the authors. Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (https://creativecommons.org/licenses/by/4.0/). Notwithstanding the ProQuest Terms and Conditions, you may use this content in accordance with the terms of the License.

Abstract

Accurate and swift evaluation of the temperature distribution in boiler furnaces is essential for maximizing energy efficiency and ensuring operational safety. Traditional temperature field reconstruction algorithms, while effective, often suffer from accumulated errors, difficulty in solving ill-posed problems, low accuracy, and poor generalization. To overcome these limitations, a Temperature Field Reconstruction Network based on an acoustic information encoder (AIE) and a temperature field reconstruction decoder (TFRD) is proposed (ATTRN). This method directly utilizes acoustic measurement data for temperature field prediction, effectively balancing global semantic capture and local detail preservation. The proposed approach avoids complex traditional mathematical processing and empirical parameter selection, enhancing both accuracy and generalization. Simulation studies and engineering validations demonstrate the performance and industrial applicability of the proposed method.

Details

Title
ATTRN: Acoustic Information Encoder and Temperature Field Reconstruction Decoder Network for Boiler Temperature Field Reconstruction
Author
Wu Kunyu 1   VIAFID ORCID Logo  ; Ni Keqi 1   VIAFID ORCID Logo  ; Chen, Liwei 2   VIAFID ORCID Logo  ; Xu Hengyuan 1   VIAFID ORCID Logo  ; Wang Junqiao 1   VIAFID ORCID Logo  ; Zhou, Jingyi 1   VIAFID ORCID Logo  ; Zhou Xinzhi 3   VIAFID ORCID Logo 

 Sichuan University Pittsburgh Institute, Sichuan University, Chengdu 610065, China; [email protected] (K.W.); [email protected] (K.N.); [email protected] (H.X.); [email protected] (J.W.); [email protected] (J.Z.) 
 College of Design and Engineering, National University of Singapore, Singapore 117575, Singapore; [email protected] 
 College of Electronics and Information Engineering, Sichuan University, Chengdu 610065, China 
First page
2567
Publication year
2025
Publication date
2025
Publisher
MDPI AG
e-ISSN
14248220
Source type
Scholarly Journal
Language of publication
English
ProQuest document ID
3194642845
Copyright
© 2025 by the authors. Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (https://creativecommons.org/licenses/by/4.0/). Notwithstanding the ProQuest Terms and Conditions, you may use this content in accordance with the terms of the License.