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© 2025 by the authors. Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (https://creativecommons.org/licenses/by/4.0/). Notwithstanding the ProQuest Terms and Conditions, you may use this content in accordance with the terms of the License.

Abstract

Printing technology has revolutionized manufacturing by enabling high-volume, multipurpose, low-cost production with minimal environmental impact. This advancement has led to the integration of flexible electronic devices, such as displays, actuators, and sensors, into various consumer markets. Over the past few decades, printed electronics have garnered significant interest from both academic and industrial communities. Among these, flexible strain sensors stand out due to their adaptability and potential for large-scale applications. However, a comprehensive analysis of their sensing performance, particularly with respect to printability, remains lacking. This review aims to systematically explore the development of flexible strain sensors produced through printing technology, focusing on key aspects such as the formulation of conductive inks, the use of diverse substrate materials, and the challenges associated with printability. Additionally, it delves into the practical applications of these sensors across multiple industries. By providing an in-depth examination of these factors, this review offers valuable insights into the current state of printed electronics and highlights their future potential in advancing flexible sensing technologies.

Details

Title
Flexible Strain Sensors Based on Printing Technology: Conductive Inks, Substrates, Printability, and Applications
Author
Xue, Qi 1 ; Luo Jingjing 1 ; Liu, Haipeng 1 ; Fan Shuheng 1 ; Ren Zhongqi 1   VIAFID ORCID Logo  ; Wang Peike 1 ; Yu Suzhu 1   VIAFID ORCID Logo  ; Wei, Jun 2 

 Shenzhen Key Laboratory of Flexible Printed Electronics Technology, Harbin Institute of Technology (Shenzhen), Shenzhen 518055, China, School of Materials Science and Engineering, Harbin Institute of Technology (Shenzhen), Shenzhen 518055, China 
 Shenzhen Key Laboratory of Flexible Printed Electronics Technology, Harbin Institute of Technology (Shenzhen), Shenzhen 518055, China, School of Materials Science and Engineering, Harbin Institute of Technology (Shenzhen), Shenzhen 518055, China, State Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology (Shenzhen), Shenzhen 518055, China 
First page
2113
Publication year
2025
Publication date
2025
Publisher
MDPI AG
e-ISSN
19961944
Source type
Scholarly Journal
Language of publication
English
ProQuest document ID
3203208268
Copyright
© 2025 by the authors. Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (https://creativecommons.org/licenses/by/4.0/). Notwithstanding the ProQuest Terms and Conditions, you may use this content in accordance with the terms of the License.