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© 2025 by the authors. Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (https://creativecommons.org/licenses/by/4.0/). Notwithstanding the ProQuest Terms and Conditions, you may use this content in accordance with the terms of the License.

Abstract

A testing method is developed to evaluate the acceleration- and strain-based fatigue life of a thermal interface layer in the high-cycle fatigue regime. The methodology adopts vibration-based fatigue testing, where adhesively bonded beams are excited at their resonant frequency under variable amplitude loading using an electrodynamic shaker. Fatigue failure is monitored through shifts in modal frequency and modal damping. Key findings include the identification of a 4% frequency shift as the failure criterion, corresponding to macro-delamination. The thickness of the thermal interface material influences acceleration-based fatigue life, decreasing by a factor of 0.2 when reduced from 0.3 mm to 0.15 mm and increasing by 5.5 when increased to 0.5 mm. Surface quality has a significant impact on both acceleration-based and strain-based fatigue curves. Beams from chemically etched aluminum–magnesium alloy specimens exhibit a sevenfold increase in fatigue life compared to beams from untreated printed circuit boards. Strain-based fatigue life increases with temperature, with a 0.2 reduction at 40 °C and an eightfold increase at 100 °C relative to 23 °C. The first principal strain ε1,rms is validated as a reliable local damage parameter, effectively characterizing fatigue behavior across varying TIM thicknesses.

Details

Title
A Vibration-Based Test Technique to Evaluate the High-Cycle Fatigue Life of Thermal Interface Layers Used in the Electronic Industry
Author
Fezai Alaa 1   VIAFID ORCID Logo  ; Sharma, Anuj 2 ; Müller-Hirsch, Wolfgang 2 ; Zimmermann André 3   VIAFID ORCID Logo 

 Institute for Micro Integration (IFM), University of Stuttgart, 70569 Stuttgart, Germany; [email protected], Mobility Electronics, Robert Bosch GmbH, Robert-Bosch-Straße 2, 71701 Schwieberdingen, Germany 
 Mobility Electronics, Robert Bosch GmbH, Robert-Bosch-Straße 2, 71701 Schwieberdingen, Germany 
 Institute for Micro Integration (IFM), University of Stuttgart, 70569 Stuttgart, Germany; [email protected] 
First page
23
Publication year
2025
Publication date
2025
Publisher
MDPI AG
ISSN
26733161
Source type
Scholarly Journal
Language of publication
English
ProQuest document ID
3223868017
Copyright
© 2025 by the authors. Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (https://creativecommons.org/licenses/by/4.0/). Notwithstanding the ProQuest Terms and Conditions, you may use this content in accordance with the terms of the License.