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Barrier and Seed Layers Deposition in TSV Using Magnetron Sputtering
Wang, Rui Dong; Zhang, Cong Chun; Ding, Gui Fu; Gao, Yang.
Applied Mechanics and Materials; Zurich Vol. 543-547, (Mar 2014): 3951-3954.
DOI:10.4028/www.scientific.net/AMM.543-547.3951
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