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© 2023 by the authors. Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (https://creativecommons.org/licenses/by/4.0/). Notwithstanding the ProQuest Terms and Conditions, you may use this content in accordance with the terms of the License.

Abstract

This paper presents a method of simulating a capacitive sensor using COMSOL Multiphysics. A petal-form sensitive electrode structure applied to a capacitive angle sensor was simulated using COMSOL software; the angle was calculated using sines and cosines with capacitance value to fill in the simulation of the capacitive angle sensor. First, according to the construction principle of the sensor structure, a GeoGebra graphing calculator with theoretical analysis and expression of function was used to obtain the two-dimensional structure of the target petal-form sensitive structure. Second, the holistic structural model was completed by importing it into COMSOL Multiphysics and setting the electrical and mechanical rotation parameters, which realized the simulation of the rotation process. Finally, because errors were found, the structure design was improved by introducing an angle between the partition domain, and the simulation errors were reduced. The resulting curves and calculated angles were consistent with the theory; the simulation results showed that the maximum angle difference value was 0.0175° and the minimum angle difference value was 0.0018° of a single cycle structure.

Details

Title
Capacitive Angle Sensor Research Using COMSOL Multiphysics
Author
Wu, Jianwen 1 ; Meng, Zhen 2 ; Zhang, Xingcheng 2 ; Mi, Wei 3 ; Yan, Yuepeng 4 

 Smart Sensing Center, Institute of Microelectronics, Chinese Academy of Sciences, Beijing 100029, China; University of Chinese Academy of Sciences, Beijing 100049, China 
 Smart Sensing Center, Institute of Microelectronics, Chinese Academy of Sciences, Beijing 100029, China 
 School of Integrated Circuit Science & Engineering, Tianjin Key Laboratory of Film Electronic & Communication Devices, Tianjin University of Technology, Tianjin 300384, China 
 Communication Center, Institute of Microelectronics, Chinese Academy of Sciences, Beijing 100029, China 
First page
2937
Publication year
2023
Publication date
2023
Publisher
MDPI AG
e-ISSN
20763417
Source type
Scholarly Journal
Language of publication
English
ProQuest document ID
2785184918
Copyright
© 2023 by the authors. Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (https://creativecommons.org/licenses/by/4.0/). Notwithstanding the ProQuest Terms and Conditions, you may use this content in accordance with the terms of the License.