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© 2022 by the authors. Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (https://creativecommons.org/licenses/by/4.0/). Notwithstanding the ProQuest Terms and Conditions, you may use this content in accordance with the terms of the License.

Abstract

The creep strain resistance of expanded polystyrene (EPS) is important; thus, time-dependent creep properties of EPS have been of significant interest. This study is a part of the computer-aided engineering (CAE) prediction-technology development for the inclination of unitized loads of packaged appliances applied to EPS-based cushioning systems. Creep properties are validated to ensure finite element analysis (FEA) reliability regarding the creep behavior of EPS-based cushioning systems. The elastic modulus and Poisson’s ratio (EPS elastic properties) as well as creep properties (plastic properties) were measured. The EPS density range was 16–30 kg/m3, and the temperature range was 0–60 °C. Because the measured mechanical properties were not temperature-dependent, only their density dependence was analyzed. The EPS behavior, measured over 12 h, exhibited a significant creep amount and rate, depending on the applied stress level. FEA was performed on 7-day-long EPS creep, using the measured EPS elastic and plastic properties. The FEA and experimental results were strongly concordant. These EPS creep validation results are expected to improve the reliability of FEA for creep behavior studies of EPS-based cushioning systems.

Details

Title
Creep Simulation and Validation for a Finite Element Analysis of Expanded Polystyrene-Based Cushioning Systems
Author
Park, Jong Min 1 ; Lee, Gun Yeop 2 ; Kim, Dong Hyun 1 ; Jung, Hyun Mo 3   VIAFID ORCID Logo 

 Department of Bio-Industrial Machinery Engineering, Pusan National University, Miryang 50463, Republic of Korea 
 Appliance Advanced Technology R&D Group, LG Electronics, Changwon 51533, Republic of Korea 
 Department of Logistic Packaging, Kyungbuk College of Science, Chilgok 39913, Republic of Korea 
First page
12663
Publication year
2022
Publication date
2022
Publisher
MDPI AG
e-ISSN
20763417
Source type
Scholarly Journal
Language of publication
English
ProQuest document ID
2756661340
Copyright
© 2022 by the authors. Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (https://creativecommons.org/licenses/by/4.0/). Notwithstanding the ProQuest Terms and Conditions, you may use this content in accordance with the terms of the License.