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© 2022 by the authors. Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (https://creativecommons.org/licenses/by/4.0/). Notwithstanding the ProQuest Terms and Conditions, you may use this content in accordance with the terms of the License.

Abstract

In order to study the material removal mechanism of Fe–C alloy surfaces in the particle microcutting process, the molecular dynamics method was used to study the material deformation and removal rules during the particle microcutting process. By analyzing and discussing the particle cutting force, atomic energy, atomic displacement, lattice structure, and dislocation in the particle microcutting process under different cutting velocities, the material removal mechanism is revealed. The results show that the atomic binding energy of Fe–C alloy increases with an increase in particle cutting velocity. The cutting force of particles and atomic potential energy of the workpiece increase obviously. The accumulated strain energy and dislocation energy in the lattice increase, the lattice deformation becomes more severe, and the material is prone to plastic deformation. The atoms form atomic groups at the front of the particle and are then remove from the surface of Fe–C alloy in the form of chips.

Details

Title
Effect of Particle Velocity on Microcutting Process of Fe–C Alloy by Molecular Dynamics
Author
Deng, Chunxia 1   VIAFID ORCID Logo  ; Li, Junye 2   VIAFID ORCID Logo  ; Meng, Wenqing 1 ; Zhao, Weihong 1 

 Ministry of Education Key Laboratory for Cross-Scale Micro and Nano Manufacturing, Changchun University of Science and Technology, Changchun 130022, China 
 Ministry of Education Key Laboratory for Cross-Scale Micro and Nano Manufacturing, Changchun University of Science and Technology, Changchun 130022, China; Chongqing Research Institute, Changchun University of Science and Technology, Chongqing 401135, China 
First page
1339
Publication year
2022
Publication date
2022
Publisher
MDPI AG
e-ISSN
2072666X
Source type
Scholarly Journal
Language of publication
English
ProQuest document ID
2706250481
Copyright
© 2022 by the authors. Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (https://creativecommons.org/licenses/by/4.0/). Notwithstanding the ProQuest Terms and Conditions, you may use this content in accordance with the terms of the License.